Optimization Scheme of SU-8 Photoresist Micro-Nano Processing The Shortcomings of Traditional SU-8 Photoresist Processing and the Advantages of Ultrasonic Spray Coating Technology In high-end manufacturing fields such as micro/nano manufacturing, MEMS devices, microfluidic chips, and precision sensing elements, SU-8 negative photoresist, with its high resolution, high aspect ratio, excellent mechanical properties, and chemical stability, has become a core material for thick-film microstructure processing. Currently, traditional SU-8 photoresist processing [...]

SU-8 Photoresist SU-8 Photoresist | MEMS/Microfluidics Dedicated Thick-Film Negative Photoresist: Performance Parameters & Application Details For micro/nano fabrication, MEMS devices, microfluidic chips, and UV-LIGA electroforming processes, one core material is almost always indispensable—SU-8 photoresist. As a mainstream epoxy-based chemically amplified negative thick-film photoresist in the industry, it has become the preferred material for research laboratories and industrial mass production due to its core advantages such as ultra-high aspect [...]

Advantages of SU-8 for Complex Microstructures Advantages of SU-8 for Complex Microstructures | Ultrasonic spraying of irregularly shaped trenches and micropores In the field of micro/nano fabrication, SU-8 photoresist is a true all-rounder. Its widespread use stems from its unparalleled superiority in fabricating complex geometries such as irregular shapes, grooves, micropores, and trenches. Here are its core advantages: High Aspect Ratio and Near-Perfect Vertical Sidewalls – A Natural [...]

Preparation Process and Quality Control of Photoresist Resin In the field of microelectronics manufacturing, with the continuous advancement of semiconductor technology, the photolithography process—as one of the critical steps—places particular emphasis on the preparation process and quality control of its core material, photoresist resin. The performance of photoresist resin not only affects pattern fidelity and production efficiency but is also subject to the combined influence of raw material [...]

Spray Coating Process for Photoresist Spray Coating Process for Photoresist: A Popular Science Summary In daily use of photoresist, spin coating is the more common application method. This article, however, focuses on the spray coating process for photoresist, covering its core principles, advantages and disadvantages, conditions for atomized spray formation, key process steps, factors affecting film properties, and preparation of compatible resists, while also mentioning relevant research achievements [...]

Polyimide Spray Coating Systems Polyimide Coating Machine for Semiconductor Wafers Ultrasonic polyimide coating equipment applies premium polyimide thin films on semiconductor wafers before the cutting procedure. This coating equipment realizes outstanding coating uniformity, accurate thickness regulation and reliable bonding force for solvent-containing polymer coating materials widely adopted in semiconductor manufacturing. As a clean and high-efficiency replacement for spin coating equipment, the ultrasonic coating technique [...]

Semiconductor Wafer Coating Wafer-Level Ultrasonic Coating for Semiconductors Ultrasonic wafer coating equipment serves as an alternative to traditional spin coating for semiconductor manufacturing, delivering superior thin-film consistency, accurate process regulation and far higher raw material utilization in photolithography workflows. Standard spin coating struggles with uneven coverage on wafers featuring steps, grooves and recessed cavities, resulting in inconsistent layering of photoresist and dielectric substances. Precision ultrasonic [...]