cheersonic, Author at Ultrasonic Coating Solutions

10 07, 2026

Core Technology Analysis of Green Hydrogen Production

Core Technology Analysis of Green Hydrogen Production Hydrogen, an energy carrier possessing both significant industrial value and clean energy attributes, continues to rise in strategic importance in the global low-carbon energy transition due to its outstanding advantages such as storability, renewability, zero-carbon production, and high energy density. Currently, industrial hydrogen production still heavily relies on fossil fuels, generating substantial carbon emissions during the production process, which contradicts the [...]

9 07, 2026

Ultrasonic Spraying Process for Li-ion Battery Ceramic Separators

Ultrasonic Spraying Process for Li-ion Battery Ceramic Separators Process Scheme for Preparing Ceramic Layers of Lithium-ion Battery Ceramic Separators Using Ultrasonic Spray Coating Based on the core requirements of lithium-ion battery ceramic separators for ceramic layers—"1-6μm thickness, uniform density, and high adhesion"—and combining the technical advantages of ultrasonic spray coating machines—"low-damage atomization and precise thickness control"—the following complete preparation scheme is formulated, covering the entire process from preliminary [...]

9 07, 2026

Innovative Solutions for Package-Level Electromagnetic Shielding

Innovative Solutions for Package-Level Electromagnetic Shielding Cheersonic Ultrasonic Spray Coating Platform: Innovative Solutions for Package-Level Electromagnetic Shielding As electronic devices continue to achieve higher levels of integration, package-level electromagnetic interference (EMI) and radio frequency interference (RFI) have become critical bottlenecks constraining product performance. Cheersonic's ultrasonic spray coating platform offers a targeted solution for package-level electromagnetic shielding coating preparation, providing an efficient pathway for shielding coating processing on various [...]

9 07, 2026

Printed Circuit Board Spray Fluxing

Printed Circuit Board Spray Fluxing The original developer of ultrasonic spray fluxing technology leads worldwide precision flux deposition for printed circuit board assembly. This ground-breaking coating technique created universal standards for accurate material application: it yields cleaner solder connections, improves top fillet geometry, and slashes flux material waste by up to 90%. Factories globally deploy this coating technology for wave and selective soldering flux processes, [...]

9 07, 2026

Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures

Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures - Cheersonic As the electronic circuit board industry rapidly upgrades towards finer wire diameters, higher density, finer hole diameters, and blind via filling, PCB copper plating, as a core process in circuit board manufacturing, directly determines the current transmission efficiency and lifespan of the product. Traditional DC electroplating processes are [...]

8 07, 2026

Polyimide Coating

Polyimide Spray Coating Systems Polyimide Coating Machine for Semiconductor Wafers Ultrasonic polyimide coating equipment applies premium polyimide thin films on semiconductor wafers before the cutting procedure. This coating equipment realizes outstanding coating uniformity, accurate thickness regulation and reliable bonding force for solvent-containing polymer coating materials widely adopted in semiconductor manufacturing. As a clean and high-efficiency replacement for spin coating equipment, the ultrasonic coating technique [...]

8 07, 2026

Ultrasonic Spray Photoresist Coating for MEMS Wafers

Ultrasonic Spray Photoresist Coating for MEMS Wafers Ultrasonic spray of photoresist for MEMS wafers and other substrates with varying topographiesFor over ten years, researchers have carried out direct photoresist spraying on MEMS wafers, silicon substrates and assorted three-dimensional microstructures. Extensive studies have validated the merits of this deposition technique when filling deeply etched, tall surface relief structures with photoresist. Compared with traditional spin coating methods, [...]

8 07, 2026

Application of Ultrasonic Spraying Technology in SOFC Fabrication

Application of Ultrasonic Spraying Technology in SOFC Fabrication Ultrasonic spraying technology, as a novel thin-film fabrication process, has demonstrated significant advantages in the fabrication of electrolyte and electrode layers in SOFCs, providing a new technical pathway for SOFC thin film preparation. This technology utilizes the atomization effect of ultrasound to transform the prepared slurry into tiny, uniform droplets. These droplets are then precisely delivered to the substrate surface [...]

8 07, 2026

Semiconductor Wafer Coating

Semiconductor Wafer Coating Wafer-Level Ultrasonic Coating for Semiconductors Ultrasonic wafer coating equipment serves as an alternative to traditional spin coating for semiconductor manufacturing, delivering superior thin-film consistency, accurate process regulation and far higher raw material utilization in photolithography workflows. Standard spin coating struggles with uneven coverage on wafers featuring steps, grooves and recessed cavities, resulting in inconsistent layering of photoresist and dielectric substances. Precision ultrasonic [...]

8 07, 2026

Sensor Coatings

Sensor Coatings Ultrasonic Thin Film Coating Solutions for Sensor Fabrication Ultrasonic spray equipment delivers premium thin film coatings on sensor components with functional nanoparticle blends, polymer materials, conductive polymer coating formulations and oxide compound mixtures. This contact-free coating technology generates even thin film layers on diverse sensor base materials, featuring highly regulated film thickness spanning nanoscale coatings up to dozens of microns. Real-time closed-loop monitoring [...]

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