Printed Circuit Board Spray Fluxing

The original developer of ultrasonic spray fluxing technology leads worldwide precision flux deposition for printed circuit board assembly. This ground-breaking coating technique created universal standards for accurate material application: it yields cleaner solder connections, improves top fillet geometry, and slashes flux material waste by up to 90%. Factories globally deploy this coating technology for wave and selective soldering flux processes, and nearly all top-tier soldering equipment OEMs integrate these coating setups within their production machinery.

For multiple decades, the technology’s original creator has driven industry advancement via ultrasonic coating hardware that delivers exceptional accuracy and repeatable coating results. Proprietary ultrasonic nozzle atomization evenly distributes flux across circuit boards and electronic components with tight thickness control. This minimizes stray overspray and removes maintenance headaches from clogged spray heads. End results include cleaner finished boards with reduced flux residue, more durable solder joints, lower equipment upkeep frequency, and improved top fillet shaping—all essential to secure consistent soldering reliability on today’s advanced PCB layouts and substrates.

Wave Solder Fluxing
Ultrasonic flux spraying, with its high precision and uniformity, has become a key technology for meeting the demands of high-density, fine-pitch PCB soldering in wave soldering processes for printed circuit board (PCB) manufacturing. It uses ultrasonic vibrations to efficiently atomize and precisely apply flux, effectively addressing the shortcomings of traditional spraying methods in delicate soldering scenarios.

Selective Solder Fluxing
The ultrasonic selective flux coating system is an advanced, high-precision automated device designed specifically for the selective soldering process in electronics manufacturing. It replaces the traditional spray or foaming process used in wave soldering, as well as manual application methods.
The core principle is to use ultrasonic energy to atomize liquid flux into extremely fine particles (forming a fine mist or aerosol). This flux is then applied non-contact and selectively, under program control, through a precision nozzle or applicator to precisely and selectively apply it to specific areas of the printed circuit board (PCB) that require soldering, such as leads and pads of through-hole components, or solder joints of surface-mount devices (SMDs) that require localized soldering.

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