Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures

Ultrasonic Spray Coating Machine for Iridium Metal Oxide Mixtures – Cheersonic

As the electronic circuit board industry rapidly upgrades towards finer wire diameters, higher density, finer hole diameters, and blind via filling, PCB copper plating, as a core process in circuit board manufacturing, directly determines the current transmission efficiency and lifespan of the product. Traditional DC electroplating processes are no longer suitable for the stringent requirements of high-end PCBs, commonly exhibiting uneven plating problems such as excessively thick copper layers at both ends of through-holes and insufficient copper layers in the center. This not only affects current transmission but also leads to a surge in product defect rates. Reducing the current density to balance the plating thickness significantly extends the production cycle. With the widespread adoption of reverse pulse electroplating technology, iridium metal oxide mixture coatings, as the core functional coating for PCB copper plating anodes, have become key to solving this problem due to their excellent electrocatalytic activity, chemical stability, and low-loss characteristics. The quality of this coating directly determines the efficiency of reverse pulse electroplating and the quality of PCB copper plating. Cheersonic ultrasonic spraying machines, with their core advantages of high precision, high stability, and high adaptability, perfectly meet the precision spraying requirements of iridium metal oxide mixtures, providing core equipment support for improving the quality and efficiency of the PCB copper plating industry.

Iridium metal oxide mixture coatings, as the core coating of the PCB reverse pulse electroplating anode, impose extremely stringent standards on the spraying process due to the process characteristics of PCB copper plating. This coating is mainly sprayed onto the surface of the PCB copper plating anode substrate, and its core function is to enhance the anode electrocatalytic performance, ensure uniform current distribution, and help the reverse pulse electroplating process to achieve its advantages. Its spraying quality is deeply linked to the uniformity of PCB copper plating and production efficiency. Based on the PCB copper plating process conditions provided by the user, the core requirements for iridium metal oxide mixture spraying are concentrated in three main aspects: First, high uniformity coating, requiring precise control of coating thickness and distribution to avoid defects such as pinholes, bubbles, and particle agglomeration, ensuring a dense, void-free coating, guaranteeing uniform anode conductivity, and adapting to the current density requirements of reverse pulse plating, thus helping to solve the problem of uneven copper plating in PCB through-holes; Second, process adaptability, requiring perfect matching with the electrolyte (CuSO₄·5H₂O 100-300g/l, H₂SO₄ 50-150g/l), temperature (20-70℃), and pulse current parameters for PCB copper plating, ensuring that the coating remains stable under these process conditions, does not undergo chemical reactions, and can withstand pulse current impacts of 500-1000A/M² in the forward direction and three times that in the reverse direction; Third, high adhesion and stability, requiring the coating to bond tightly to the anode substrate, withstand electrolyte corrosion during the electroplating process, reduce coating loss rate, extend anode lifespan, and meet the cleanliness requirements of PCB production, preventing coating peeling and contamination of the plating solution. Currently, in the field of iridium oxide mixture spraying, traditional spraying processes (high-pressure gas atomization spraying, plasma spraying, and manual coating) have many shortcomings, making them difficult to adapt to the process requirements and large-scale mass production needs of PCB copper plating, thus becoming a bottleneck restricting the improvement of PCB copper plating quality and efficiency. High-pressure gas atomization spraying is prone to problems such as uneven droplet size and large coating thickness deviations. High-pressure gas flow can also lead to excessively high coating porosity, reducing its electrocatalytic performance and corrosion resistance, and failing to meet the current uniformity requirements of reverse pulse electroplating. Plasma spraying equipment is costly and the process is complex. The high-temperature flame can easily destroy the active components of iridium oxide, leading to coating performance degradation, and it is difficult to accurately control the coating thickness, resulting in poor adaptability. Manual coating is inefficient, produces poor coating uniformity, and manual operation can easily introduce impurities that contaminate the plating solution. Furthermore, it cannot be matched with automated production lines for PCB copper plating, making it difficult to meet the needs of large-scale mass production.

Cheersonic ultrasonic spray coating machine addresses the characteristics of iridium oxide mixtures, the requirements of PCB copper plating processes, and the pain points of traditional spray coating. Leveraging its core high-frequency ultrasonic atomization technology and combining it with key aspects of reverse pulse electroplating, it creates a customized solution that completely breaks through traditional process bottlenecks. The equipment converts industrial frequency electricity into a 40-150kHz high-frequency electrical signal via an ultrasonic generator. This signal is then converted into high-frequency mechanical vibration by a piezoelectric ceramic transducer. Utilizing the ultrasonic cavitation effect, the iridium oxide mixture slurry is atomized into fine droplets of 0.01-2 microns, effectively deagglomerating particle clusters in the slurry, precisely controlling the solvent evaporation rate, and ensuring a uniform, fine, dense, and void-free coating. This perfectly matches the core requirements of the PCB copper plating reverse pulse process, helping to improve the uniformity of anodic conductivity and solving the problem of uneven copper plating in through-holes. The atomization process is conducted under low pressure and temperature control throughout, precisely matching the PCB copper plating process temperature of 20-70℃. Droplets are gently deposited on the anode substrate surface guided only by a small amount of carrier gas, without mechanical contact or high-temperature damage, thus preserving the active components of the iridium oxide. Spraying parameters can be flexibly adjusted to adapt to the spraying needs of different PCB copper plating anode specifications, and it is compatible with automated large-scale production lines.

Addressing the core needs of iridium oxide mixture spraying and PCB copper plating, Cheersonic ultrasonic spraying machines demonstrate four core advantages, helping companies achieve large-scale, high-quality mass production. Firstly, ultra-precise and uniform coating, achieving a coating uniformity of over 99%, effectively ensures uniform anode conductivity, adapts to the current density requirements of reverse pulse electroplating, and helps solve the problem of uneven copper plating in PCB through-holes and micro-holes, improving PCB product yield.
Secondly, strong process adaptability allows for precise matching of electrolyte, temperature, and pulse current parameters for PCB copper plating, ensuring coating stability under stringent process conditions, reducing coating loss rate, and extending anode lifespan.

Thirdly, high material utilization, reaching over 95%, significantly reduces waste of expensive iridium metal oxide mixtures, lowers PCB copper plating production costs, and meets the economic needs of large-scale industrial production.
Fourthly, excellent mass production adaptability supports automated continuous spraying and cleanroom adaptation, seamlessly integrating into automated PCB copper plating production lines, adapting to the coating of different anode specifications without dead angles, and solving the problems of low efficiency, high loss, and poor consistency in traditional processes.

Currently, Cheersonic ultrasonic spraying machines are widely used in iridium oxide mixture spraying scenarios, deeply adapted to PCB copper plating reverse pulse processes, covering core products such as high-density PCBs, fine-diameter circuit boards, and blind-via filling circuit boards. This helps companies solve problems caused by traditional spraying processes, such as uneven coating, rapid anode loss, and high PCB copper plating defect rates, thus improving the quality and efficiency of the PCB copper plating industry. As a leading company in the field of ultrasonic electronic equipment, Cheersonic Ultrasonic has been deeply involved in the PCB copper plating supporting spraying field for many years. Following the trend of the PCB industry towards high density and fine line diameter, and combining the upgrade needs of reverse pulse electroplating processes, Cheersonic can provide customized spraying solutions, covering the entire process from equipment selection and process parameter optimization to slurry adaptation. In the future, Cheersonic Ultrasonic will continue to optimize equipment performance, further improve spraying accuracy and process adaptability, help the PCB copper plating industry break through technical bottlenecks, and inject strong momentum into the high-quality development of electronic circuit boards, smart terminals, and other fields.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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