Flux System

Customized double-entry precision ultrasonic coating equipment can quickly select and replace flux 1 and flux 2, and can quickly change the process without manually changing the flux delivery configuration. The customized UEC2100 has a high-precision flux transfer pump, selective area flux function and compatibility with all fluxes. Cheersonic’s ultrasonic spray flux system is compatible with all flux types, and system components can be configured to handle aggressive water-soluble fluxes.

The Cheersonic ultrasonic spray flux system can be easily integrated with the wave soldering machine, and the maintenance cost is extremely low, and it is not clogged, has a highly repeatable spray performance, and can reduce the flux consumption by up to 80%. Cheersonic’s ultrasonic spraying machine is specially designed for PCB manufacturers. This new dual flux option provides the greatest flexibility in the wave soldering flux process.

Ultrasonic Flux Spraying System

The ultrasonic flux spraying system is a high‑precision automated coating device optimized for electronics soldering and aluminum brazing processes, widely integrated with wave soldering and selective soldering production lines. It converts electric energy into high‑frequency mechanical vibration via piezoelectric transducers, atomizing liquid flux into consistent micron‑sized droplets without high‑pressure pneumatic blasting. Guided by low‑directional airflow, fine mist deposits evenly on target soldering zones.

Different from conventional pressure‑driven spraying, the non‑clogging ultrasonic nozzle avoids blockage risks from high‑solid‑content flux. It supports no‑clean, water‑soluble, rosin‑based and VOC‑free flux formulations, delivering thin, repeatable flux films on complex PCB geometries, through‑holes and dense component gaps. Material utilization rises sharply, cutting flux consumption by up to 80‑90 % and lowering operating costs and chemical waste.

Gentle low‑velocity spraying greatly reduces overspray and stray flux contamination, minimizing post‑solder cleaning work and residue‑caused reliability failures. Programmable spray width, flow rate and motion enable full‑board coverage or precise selective‑area spraying, securing stable solder joint quality and preventing bridging or cold‑soldering defects. Featuring digital parameter setting, easy retrofitting and low maintenance, this system fits both R&D trials and high‑volume mass production for automotive electronics, PCB assembly and aluminum heat‑exchanger brazing applications.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
The Company’s solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Cheersonic’s growth strategy is focused on leveraging its innovative technologies, proprietary know-how, unique talent and experience, and global reach to further develop thin film coating technologies that enable better outcomes for its customers’ products and processes. For further information, visit https://cheersonic-liquid.com/.