What is Semiconductor Before the discovery of semiconductors, people believed that materials in the world could only be divided into "conductive" and "non-conductive (insulating)" according to the classification of conductivity. According to the principle of "mutual independence and complete exhaustion" in the classification method, this is a very perfect classification method for materials in the world. Why does the classification of "semiconductor" still exist? In some documents, "semiconductor" [...]

Classification of Transistors In the past 100 years, during the development of semiconductor transistors, pioneering scientists and engineers have constantly tried various device structures and device materials to meet the requirements of integrated circuit characteristics in different fields. Various semiconductor devices are produced. Semiconductors are inherently abstract and elusive. The various names and abbreviations of semiconductors also make semiconductors more unpredictable, which brings many troubles to the electronics [...]

Post-Moore era In the past forty years, the continuous development of technology and architecture design has jointly promoted the continuous advancement of Moore's Law. Even today, there are still 3nm, 2nm, and 1nm advanced technologies that are far away on the horizon. However, in terms of actual trends, higher technology, more cores, and larger chip areas can no longer bring the comprehensive advantages of cost, performance, and power [...]

SiC Power Module Package Form With the development of emerging strategic industries, the application requirements of the third generation wide bandgap power semiconductor silicon carbide materials and chips, the module packaging technology at home and abroad has also developed rapidly, and the pursuit of packaging technology with low stray parameters and small size has become a close focus of packaging. Focus, domestic and foreign scientific research teams and [...]

Prospect of SiC Power Module Packaging Technology Traditional material processes based on welding and wire bonding have unsolvable problems such as low melting point, high temperature creep failure, wire winding, parasitic parameters, etc. New interconnect materials are developing from welding to crimping and sintering technology. Compared with soldered power modules, the advantages of press-fit modules are as follows. (1) Welding connects the chip and the PCB board through [...]

SiC Power Semiconductor In recent decades, power semiconductor devices based on the newly developed third-generation wide bandgap power semiconductor material silicon carbide (SiC) have attracted much attention due to their excellent performance. Compared with the first generation of semiconductor materials silicon (Si), germanium (Ge) and the second generation of semiconductor materials gallium arsenide (GaAs), gallium phosphide (GaP), GaAsAl, GaAsP and other compounds, SiC has wider band gap, stronger [...]

Technical characteristics of micromachining process Silicon micromachining technology is developed from semiconductor integrated circuit technology. First of all, it draws on the mature microfabrication technology in the integrated circuit process, such as: photolithography, diffusion, ion implantation, epitaxy and film deposition. In addition, after more than 20 years of development, silicon micromachining technology has formed its own characteristics. Unlike the planar technology of integrated circuits, micromachining is basically a [...]

Technical Features of Silicon Micromechanical Sensors Silicon micromechanical sensor is a new type of sensor developed based on silicon micromachining technology. Its main performance characteristics are as follows: 1 Miniaturization and integration Silicon micromechanical sensors use micron-scale micromachining technology to manufacture micron-sized sensor sensitive elements. This kind of device is easy to integrate, so that two-dimensional or three-dimensional sensor arrays can be formed, and integrated large-scale integrated circuit, [...]

Silicon Micromechanical Sensors With the emergence of silicon micromachining technology, silicon micromechanical sensors have emerged. Compared with classic sensors, this new type of sensor has the advantages of small size, easy integration, low cost, low power consumption, fast speed and high reliability. and high precision. Further integrating this sensor with an integrated circuit can form a powerful smart sensor, and smart sensors are the main direction of sensor [...]

Ultrasonic Spray Pyrolysis For Chemical Deposition Ultrasonic Spray Pyrolysis For Chemical Deposition - Cheersonic A coating layer on a substrate, such as a ceramic film (i.e., coating) deposited on a metal or oxide substrate, can be obtained by several methods. The advantages that ultrasonic spray pyrolysis exerts in the art are well known. Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, [...]