MSN1000 Sprinkler Megasonic Cleaning Nozzle

MSN1000 Sprinkler Megasonic Cleaning Nozzle

Generally, the particle size suitable for megasonic cleaning is 0.1~0.3 μm, and the effect of megasonic cleaning is milder.

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Sprinkler Megasonic Cleaning Nozzle

We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more.

The principle of spray-type megasonic nozzle cleaning is mainly due to the effect of sound pressure gradient, particle velocity and sound flow, while the cavitation effect is secondary. cleaned. During cleaning, bubbles like ultrasonic cleaning are not formed, but the high-speed micro water flow formed by high-frequency sound wave energy in the cleaning solution continuously impacts the surface of the wafer, so that the surface of the object surface is less than 0.2μm. The contaminants and fine particles are forcibly removed and entered. into the cleaning solution.

  • CMP chemical mechanical polishing
  • Cleaning before bonding
  • Mask cleaning
  • Development
  • Lift-off Metal Stripping
  • Wet etching
  • Lens cleaning
  • Precision cleaning in the microelectronics industry such as display screens
  • Silicon
  • GaAs
  • Indium Phosphide
  • Gallium Nitride
  • Silicon carbide
  • Lithium Niobate
  • Lithium tantalate, etc.

PERFECTING YOUR PROCESS

Features

• Can remove tiny particles smaller than 0.2μm
• Avoid possible damage to the surface of the object caused by cavitation
• High-density energy provides efficient cleaning
• High-speed flow in a linear direction prevents impurities from re-adhering to the surface of the object
• Comprehensive non-metallic high anti-corrosion material, suitable for various acids, bases and organic solvents
• The megasonic generator of the third-generation semiconductor technology fully realizes digital high-frequency high-power drive

Basic Specifications

• Megasonic frequency 1000kHz
• Maximum power 40W
• Maximum power 1200-4800W
• Housing material PVC
• Housing material PEEK, PCTFE
• Suitable for wafers 6″, 8″, 12″
• Liquid temperature <70°C
• Ambient temperature 10-40°C

OUR EXPERTISES

Cheersonic offers innovative and customized solutions that will meet your needs. Discover how our expertise, combined to yours, can speed up your production.

Robotics solutions

Cheersonic designs robotic solutions for companies seeking to improve the automation of their transformation process.

Custom manufacturing

Cheersonic presents the techniques used to design equipment that meets the specific needs of a particular process.

Mechanical and electrical engineering

Cheersonic demonstrates its design and engineering expertise through the work of its skilled engineers.

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Contact CHEERSONIC For immediate assistance please contact us the corporate headquarters during business hours at 6:00 am – 22:00 pm.

  • Tel: 0571-87910406

  • Mobile: +86 13588732518
  • Email: Market2@cheersonic.com
  • Add: 11-13 Chuangye Road, Changkou, Fuyang, Hangzhou, Zhejiang, China

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