MSU1000 Fitted Megasonic Cleaning System

Fitted megasonic cleaning system technology not only preserves the advantages of ultrasonic cleaning technology, but also overcomes some of its shortcomings.

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Fitted Megasonic Cleaning System

We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more.

Fitted megasonic cleaning system Megasonic cleaning technology not only preserves the advantages of ultrasonic cleaning technology, but also overcomes some of its shortcomings. The mechanism of megasonic cleaning technology is the chemical reaction of chemical cleaning agents combined with high-frequency vibration slices for cleaning. So far, the megasonic cleaning method has become the most widely used and effective method in polishing wafer cleaning. Generally, the particle size suitable for removal by megasonic cleaning is 0.1~0.3 μm, and the particle size suitable for removal by ultrasonic cleaning is above 0.4 μm. The effect of megasonic cleaning is gentler. Therefore, an appropriate vibration frequency should be selected according to the size of the particles to be removed and the impact force that the device on the wafer surface can withstand.

  • CMP chemical mechanical polishing
  • Cleaning before bonding
  • Mask cleaning
  • Development
  • Lift-off Metal Stripping
  • Wet etching
  • Lens cleaning
  • Precision cleaning in the microelectronics industry such as display screens
  • Silicon
  • GaAs
  • Indium Phosphide
  • Gallium Nitride
  • Silicon carbide
  • Lithium Niobate
  • Lithium tantalate, etc.

PERFECTING YOUR PROCESS

Features

• Reduced cleaning difficulty
• Increased cleaning efficiency
• Can work in multiple areas, compatible with 8″ and 12″
• Reduced chemical consumption
• No chemical pollution is generated
• No damage to the substrate surface
• Control the thickness of silicon and oxide layers
• No risk of conductive material falling off

Basic Specifications

• Megasonic frequency 1MHz
• Power density <2W/cm2
• Housing material PEEK
• Vibrator Material Quartz or Sapphire
• Cooling air flow 10L/min
• Liquid flow 0.5-3.0 L/min
• Applicable wafers 4″, 6″, 8″, 12″
• Liquid temperature <70°C
• Ambient temperature 10-40°C

OUR EXPERTISES

Cheersonic offers innovative and customized solutions that will meet your needs. Discover how our expertise, combined to yours, can speed up your production.

Robotics solutions

Cheersonic designs robotic solutions for companies seeking to improve the automation of their transformation process.

Custom manufacturing

Cheersonic presents the techniques used to design equipment that meets the specific needs of a particular process.

Mechanical and electrical engineering

Cheersonic demonstrates its design and engineering expertise through the work of its skilled engineers.

DO YOU NEED ULTRASONIC COATING?

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Contact CHEERSONIC For immediate assistance please contact us the corporate headquarters during business hours at 6:00 am – 22:00 pm.

  • Tel: 0571-87910406

  • Mobile: +86 13588732518
  • Email: Market2@cheersonic.com
  • Add: 11-13 Chuangye Road, Changkou, Fuyang, Hangzhou, Zhejiang, China

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