ULTRASONIC SPRAY ELECTRONICS
Ultrasonic spraying, with its advantages of precise, controllable spray flow rate, thin, uniform coatings, and controllable spray coverage, is ideally suited for spray coating electronic products and is increasingly being used in research and production. Ultrasonic spraying can deposit uniform coatings on substrates of any width. Ultrasonic spraying produces these very thin coatings with exceptional uniformity, resulting in precise and repeatable results that enhance product functionality. Applications of ultrasonic spraying in semiconductor electronics:
- Silicon wafer surface coating: As a critical pre-process step in semiconductor manufacturing, its non-contact nature eliminates the risk of wafer breakage during roller coating and reduces fragmentation.
- Wafer manufacturing and photolithography: In TSV processes, ultrasonic spraying can precisely coat the inner walls of through-holes with a 10:1 aspect ratio, achieving photoresist bottom coverage exceeding 92%, avoiding the hole bottom gaps associated with traditional spin coating and reducing the risk of electroplating shorts.
- Fan-out packaging: When dielectric materials (such as BCB adhesive) are sprayed on the surface of reconstituted wafers, micron-level gaps between circuits can be filled, improving the insulation and mechanical strength of RDLs. Silicon Carbide Wafer Processing: Uniform anti-reflective coating (ARC) spraying improves SiC power device lithography accuracy and mitigates light reflection interference from high-refractive-index materials.
- Chip Packaging: 5G power chip substrates are coated with an aluminum nitride ceramic insulation layer, boasting a thermal conductivity of >180W/(m·K), a 10-fold improvement over traditional polymers, addressing heat dissipation challenges in high-density integrated circuits.
- MEMS Sensor Manufacturing: Spraying a 5μm zirconium oxide ceramic sensitive layer reduces sensor response time from 10ms to 1ms, achieving an accuracy of 0.1% FS, meeting the requirements of autonomous driving LiDAR and other applications.
TOUCH SCREEN
Ultrasonic spray has significant advantages over other coating methods for functional glass coatings such as Transparent Conductive Oxide coatings.
- Utilization rate of solution reaches 95% and above.
- Very thin, uniform, durable layers
- Drastically reduced maintenance compared to pressure spray
MEGASONIC CLEANING SYSTEMS
Cheersonic can provide megasonic cleaning equipment with a frequency of 900kHz-3000kHZ. Ultra-high frequency ultrasonic waves at the megahertz level have higher cleaning accuracy and are widely used in semiconductor cleaning, development, glue removal, etching and other fields.
Very low ultrasonic cavitation effect, no damage to the device surface.
Ultra-high cleaning accuracy.
- High corrosion resistance, resistant to various acid and alkali solutions and organic solvents.
EMI SHIELDING SPRAY COATING
Ultrasonic spraying technology, combined with a low-temperature thermal curing process, offers a cost-effective alternative to expensive sputtering equipment for package-level EMI shielding. High-performance silver-based EMI shielding spray materials are applied in mobile device production using a fully automated XYZ motion-controlled spray system. This system can be configured for in-line transfer mode to meet high production throughput requirements.
PROTECTIVE FILM COATING
Ultrasonic coating technology has proven to be a reliable, repeatable, and efficient method for applying a variety of chemical materials to silicon wafer surfaces for wafer and bump protection prior to dicing, grinding, and polishing. Commonly used materials include easy-to-remove chemical coatings such as Z-Coat and PMMA. Our nozzle systems can be customized to meet our customers’ specific coating requirements and challenges for dicing protective films.
5G HEAT DISSIPATION MATERIAL
Ultrasonic heat-dissipating material slicer has fast cutting speed, smooth and flat incision, time-saving, high-efficiency and labor-saving.
The cut surface is smooth and beautiful.
Simple and fast product positioning, multi-functional and all-round cutting according to needs.
During the slitting process, the operation is automatically completed without human intervention, which improves work efficiency.
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Advantage:
- Ability to spray small target areas
- Uniform flux application
- Ability to control flux thickness, coating thickness is only about 20 microns
- Uniform film coverage of various surface contours
- Not blocked
- Reproducible spray process
- Ability to deposit highly uniform thin nanolayers
- Ultrasonic vibrations suspend solids in solution
- Get very accurate and repeatable results to increase product efficiency
- Reduce process waste and overspray
- Improve process efficiency and make OLEDs more economically viable
Application:
- Spray flux
- Photoresist
PCB flux
Flux brazing
Flip chip
Precision electronics
- Carbon nanotubes
- Graphene coating
- OLED
- Transparent conductive oxide
- Sensor manufacturing
- Semiconductor
- Welding powder
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Contact CHEERSONIC For immediate assistance please contact us the corporate headquarters during business hours at 6:00 am – 22:00 pm.
Tel: 0571-87910406
- Mobile: +86 13588732518
- Email: Market2@cheersonic.com
Add: 11-13 Chuangye Road, Changkou, Fuyang, Hangzhou, Zhejiang, China
