USP6000 Ultrasonic Spray Photoresist Coating for Wafers

Cheersonic provides wafer-level ultrasonic coating systems that replace traditional spin coating methods in the semiconductor industry—offering unmatched film uniformity, process control, and material efficiency for the photo-lithography process.

As an independent fully enclosed ultrasonic coating unit, the USP6000 caters to ultra-precise semiconductor production including MEMS chips and deep trench substrate structures, offering an all-in-one coating solution for 100, 150, 200 and 300mm silicon wafers.

It is customized for photoresist and protective coating procedures requiring micron-level precision, ideal for deep trench geometries and compact MEMS components. Cheersonic’s precision ultrasonic spray process solves this limitation by depositing highly uniform, defect-free film coatings over complex wafer topographies and across a wide range of substrates, including silicon and ceramics.

Compared with spin coating and other photoresist coating processes, ultrasonic atomization spraying technology boasts distinct competitive edges:

• Capable of forming ultra-even thin film layers, and delivers stable coating effect on deep trenches featuring high aspect ratios that are hard to process via traditional approaches.
• Adopts low-speed atomized spraying mode to guarantee repeatable and stable coating performance.
• The diameter of atomized droplets is adjustable by tuning the operating frequency of the atomizing nozzle.
• The equipment is equipped with a fully automatic XYZ three-axis movement platform supporting program parameter customization.
• Ultrasonic atomizing nozzle assemblies feature outstanding compatibility and can be seamlessly embedded into mass production lines.

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