Photoresist Deposition for Microelectronics Photoresist Deposition onto Unconventional Substrates for Microelectronics ManufacturingSpin coating technology faces major limitations when applied to oversized, curved and specially shaped substrates in microelectronic fabrication. As an alternative, ultrasonic spray coating technology is capable of forming highly uniform and conformable photoresist films on the full surface and microstructures of such unconventional substrates. It facilitates high-precision photolithographic processing for cutting-edge optical, electronic, [...]

Panel Level Packaging (PLP) Panel-Level Packaging Advanced Photoresist Coating Solutions for Semiconductor Panels With advanced packaging technology shifting from wafer-based processing to oversized panel manufacturing formats, conventional spin coating can no longer deliver even photoresist coverage on expansive rectangular substrates. Ultrasonic spray coating technology delivers an accurate, mass-producible deposition method to form evenly distributed photoresist thin films on panel packaging substrates, applicable to [...]

Aerospace Coating High-precision ultrasonic spraying equipment produces exceptionally even micro-thin coating layers for aerospace parts, an industry segment where dependable quality and stable functional output stand as core requirements. The contact-free, low-speed spraying technique achieves superior thin-film regulation while cutting material loss, supporting even coating coverage across intricately shaped workpieces and premium raw materials. Widely adopted in aerospace production and research labs, this spraying technology meets strict [...]

Photoresist Spraying on IGBT Module Packages Photoresist Spraying on IGBT Module Packages - Cheersonic With the rapid development of industries such as new energy vehicles, rail transit, and industrial frequency converters, IGBTs, as core power semiconductor devices, have their module packaging process directly determining their voltage withstand capability, heat dissipation, insulation, and long-term operational stability. Photoresist spraying is a critical step in IGBT module packaging. Traditional spin coating, [...]

Advanced Packaging Photoresist Coatings Panel-Level Packaging: Advanced Photoresist Coating Technology Empowering Semiconductor Advanced Processes With the rapid iteration of AI computing power and the continuous upgrading of semiconductor chip performance, advanced packaging has become a core track to break through the bottlenecks of chip manufacturing processes and improve device integration. As a disruptive packaging technology, Panel-Level Packaging (PLP) is gradually replacing traditional wafer packaging due to its high [...]

High-Reliability Single-Core Power Microprocessor Coating Performance Comparison Between Ultrasonic Spraying and Conventional Deposition Methods for Microprocessor Interconnect Dielectric Layers In fields with stringent reliability requirements, such as industrial automation, automotive electronics, network security, and the Internet of Things, the high-reliability single-core power microprocessor serves as the core control unit. Its advantages—simplified structure, low power consumption, strong anti-interference, and stable operation—make it the "nerve center" of various high-end embedded [...]