Ultrasonic Spray Fluxing for PCBs Ultrasonic spray fluxing is widely used in printed circuit board (PCB) assembly. This technology establishes high-precision coating standards, enabling the formation of clean solder joints and optimized wetting on pads, while reducing flux consumption by up to 90%. These solutions are extensively deployed globally for wave soldering and selective soldering applications and have been adopted by numerous leading equipment manufacturers. Leveraging mature ultrasonic [...]

Ultrasonic Spray Fluxing Process for Flip-Chip Bonding Ultrasonic Spray Fluxing Process for Flip-Chip Bonding | High-Precision Selective Fluxing Solution Process Overview: High-Precision Selective Ultrasonic Spray Fluxing Technology Ultrasonic selective spray fluxing is a precision process designed for PCB and advanced packaging workflows. Its core advantage lies in the ability to deposit a highly uniform, ultra-thin flux film onto specific areas with minimal overspray and no risk of nozzle [...]

Selective Flux Spraying Ultrasonic selective spraying equipment; flux spraying equipment; selective flux spraying In sectors relying on soldering processes—such as electronics manufacturing and automotive component processing—the precision of flux application directly determines soldering quality and production efficiency. Leveraging unique atomization principles and precise control capabilities, ultrasonic selective spraying equipment has become a key technology for upgrading flux application processes. It effectively resolves issues inherent in traditional methods—such as [...]