MSN1000 Sprinkler Megasonic Cleaning Nozzle Generally, the particle size suitable for megasonic cleaning is 0.1~0.3 μm, and the effect of megasonic cleaning is milder. CONTACT US Sprinkler Megasonic Cleaning Nozzle We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more. [...]

MSU1000 Fitted Megasonic Cleaning System Fitted megasonic cleaning system technology not only preserves the advantages of ultrasonic cleaning technology, but also overcomes some of its shortcomings. CONTACT US Fitted Megasonic Cleaning System We specialize in providing customized solutions to meet the needs of emerging cutting-edge industries such as nanotechnology, fuel cells, semiconductors, medical coatings, spray pyrolysis and more. [...]

Photoresist Composition Photoresist Composition - Deposition of Thin Photoresist Films - Cheersonic Photoresist is a mixed liquid that is sensitive to light. Its components include: photoinitiators (including photosensitizers, photoacid generators), photoresist resins, monomers, solvents and other additives. Photoinitiators (including photosensitizers, photoacid generators): Photoinitiators, also known as photosensitizers or photocuring agents, are a type of energy that can absorb a certain wavelength from light (usually ultraviolet light). Photochemical reactions [...]

Semiconductor Packaging Semiconductor Packaging - Semiconductor Coating Systems - Cheersonic A wafer that has been processed through the previous processes results in square chips of equal size (also known as "single wafers"). The next thing to do is to get the individual chips by dicing. Freshly cut chips are fragile and cannot exchange electrical signals, and need to be handled separately. This process is encapsulation, which involves forming [...]

Semiconductor Testing Semiconductor Testing - Semiconductor Coating Systems - Cheersonic The main goal of the test is to check whether the quality of the semiconductor chip reaches a certain standard, thereby eliminating defective products and improving the reliability of the chip. In addition, tested defective products do not enter the packaging step, helping to save cost and time. Electronic Die Sorting (EDS) is one test method for wafers. [...]

Semiconductor Interconnect Semiconductor Interconnect - Semiconductor Coating Systems - Cheersonic The conductivity of semiconductors lies between conductors and nonconductors (i.e. insulators), a property that allows us to fully control the flow of electricity. Components such as transistors can be built through wafer-based lithography, etching and deposition processes, but they also need to be connected to send and receive power and signals. Metals are used for circuit interconnection because [...]

Wafer Thin Film Deposition Wafer Thin Film Deposition - Photoresist Coating - Cheersonic To create the tiny devices inside the chip, we need to continuously deposit layers of thin films and etch away the excess, as well as add materials to separate the different devices. Each transistor or memory cell is built step-by-step through the above process. By "thin film" we mean here a "film" that is less [...]

Wafer Etching Wafer Etching - Polyimide Coatings - Photoresist Coating - Cheersonic After the photolithography of the circuit pattern on the wafer is completed, an etching process is used to remove any excess oxide film and leave only the semiconductor circuit pattern. To do this requires the use of liquid, gas or plasma to remove selected excess. There are two main methods of etching, depending on the substance [...]

Wafer Lithography Wafer Lithography - Polyimide Coatings - Photoresist Coating - Cheersonic Lithography is the "printing" of a circuit pattern onto a wafer by light, which we can understand as drawing the plan on the surface of the wafer required for semiconductor fabrication. The higher the fineness of the circuit pattern, the higher the integration of the finished chip, which must be achieved through advanced lithography technology. Specifically, [...]

Wafer Processing Wafer Processing - Photoresist Deposition System - Cheersonic All semiconductor processes start with a grain of sand! Because the silicon contained in the sand is the raw material needed to produce wafers. Wafers are circular slices formed by cutting a single crystal cylinder of silicon (Si) or gallium arsenide (GaAs). To extract high-purity silicon materials, silica sand, a special material with a silicon dioxide content of [...]