Photoresist Ultrasonic Coating System
Photoresist Ultrasonic Coating System The new photoresist ultrasonic coating system has been designed specifically to meet the unique challenges of coating high aspect ratios and deep well topographies such as MEMS wafers with photoresist. Cheersonic has extensive application expertise in depositing photoresist onto MEMS and other semiconductor wafer substrates. The ultrasonic coating system replaces traditional spin coating equipment, providing more uniform coverage of side walls in difficult to [...]

