Sensor Thin Film Coating Ultrasonic Spraying Equipment Technical Characteristics and Applications of Ultrasonic Spraying Equipment in Sensor Thin Film Coating Preparation Ultrasonic spraying equipment utilizes functional nanoparticles, polymers, conductive polymer coating systems, and oxide composite material formulations to prepare high-quality thin film coatings for sensor surfaces. Its non-contact coating process can precisely cover homogeneous films onto the surfaces of various sensor substrates. The film thickness can be precisely [...]

Ultrasonic Spraying Antireflective Film (AR Film) Analysis and Application of Ultrasonic Spraying Antireflective Film (AR Film) Technology Antireflective films (AR films), as functional thin films that reduce optical surface reflection and improve light transmittance, are widely used in optical devices, electronic displays, photovoltaic energy, and other fields. Ultrasonic spraying technology, with its precise control, high efficiency, and environmental friendliness, has become one of the core processes for preparing [...]

Complete Analysis of Coatings for Touch-Controlled Products What kind of coating is applied? Based on their functions, they can be mainly divided into the following major categories: 1. Anti-Reflective Coating What it is: A very thin coating that utilizes the principle of optical interference to eliminate reflected light. It is typically composed of multiple layers of metal oxides (e.g., silicon dioxide, zirconium dioxide, etc.). What it does: Improves [...]

Photoresist Spraying on IGBT Module Packages Photoresist Spraying on IGBT Module Packages - Cheersonic With the rapid development of industries such as new energy vehicles, rail transit, and industrial frequency converters, IGBTs, as core power semiconductor devices, have their module packaging process directly determining their voltage withstand capability, heat dissipation, insulation, and long-term operational stability. Photoresist spraying is a critical step in IGBT module packaging. Traditional spin coating, [...]

Advanced Packaging Photoresist Coatings Panel-Level Packaging: Advanced Photoresist Coating Technology Empowering Semiconductor Advanced Processes With the rapid iteration of AI computing power and the continuous upgrading of semiconductor chip performance, advanced packaging has become a core track to break through the bottlenecks of chip manufacturing processes and improve device integration. As a disruptive packaging technology, Panel-Level Packaging (PLP) is gradually replacing traditional wafer packaging due to its high [...]