SEMICONDUCTOR COATING

The ultrasonic coating system can use advanced layering technology to precisely control the flow rate, coating speed and deposition amount. Low-speed spray forming defines an atomizing spray as a precise, controllable pattern, avoiding excessive spraying when producing very thin and uniform layers. It turns out that direct spraying using ultrasonic technology is a reliable and effective way to deposit photoresist on 3D microstructures, thereby reducing equipment failures caused by excessive metal exposure to etchant.

Ultrasonic spray systems have proven to be suitable for a variety of applications that require uniform, repeatable photoresist or polyimide film coatings. Cheersonic’s coating system can control thicknesses from sub-micron to more than 100 microns, and can coat any shape or size. It is a feasible alternative to other coating technologies such as spin coating and traditional spray coating.

Cheersonic’s non-blocking ultrasonic coating technology is known for its ultra-thin micron-layer coatings of functional and protective materials. The ultrasonic vibration of the nozzle effectively dispersed the particles in the suspension and produced a very uniform particle dispersion in the film layer, while the conductive particles did not settle out of the suspension.

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