Semiconductor Packaging Market
Semiconductor Packaging Market – Photoresist Spray Coating – Cheersonic
The packaging market is often overlooked!
There have always been three pillars of semiconductor engineering: lithography, transistor design, and materials, and now, packaging has become the fourth pillar. Most semiconductor devices are encapsulated in ceramic, metal or plastic to prevent damage to the chip and its fragile connections. Despite this important function, packaging is one of the most neglected aspects of semiconductor design. However, as Moore’s Law gradually reaches its limit, packaging has now become a part of foundries, OSATs, and chip designers competing to pay attention. It affects power consumption, performance and cost at the macro level, and affects the fundamentals of all chips at the micro level. Function.
Packaging is the back end of the semiconductor supply chain, and its key metrics are often price and durability. In the past, no packaging company was considered as important as traditional front-end manufacturing (i.e. wafer fabrication and wafer sorting) processes. Because relatively speaking, the time and expenditure required for back-end operations are much less, and the capacity expansion of packaging is relatively fast, and everyone does not realize that it will interfere with the supply chain.
But now, with Moore’s Law reaching its limit, more and more chip design companies, more and more chip types and performance requirements, packaging is now essential at all levels, and with the increasing complexity and profitability In order to improve, packaging has become an important link that includes chip design manufacturers, IDMs, foundries, and OSATs.
Intel sees packaging as a catalyst for product innovation. As the physical interface between the processor and the motherboard, chip packaging plays a critical role in product-level performance. Intel’s “Lakefield” processors combine a hybrid CPU with their Foveros 3D packaging technology. On December 16, 2021, Intel announced that it will invest 30 billion ringgit (about 45.35 billion yuan) in Malaysia in the next ten years to build state-of-the-art packaging manufacturing equipment.
Packaging technology is very important for the proper operation of high-performance devices. For example, to send and receive a large amount of data at the same time, it is necessary to form countless electrical paths connected to the outside, and the encapsulation process plays this role. Packaging technology stacks multiple chips to achieve 4 times, 16 times or even more capacity than conventional chips, or combines multiple types of chips into a system. In other words, depending on the packaging technology, the added value of the product can be greatly increased. Today, chip technology alone cannot dominate the future market without advances in packaging technology.
There is no doubt that packaging, as an important part of the industry chain, has become the focus of major manufacturers. The slowdown in Moore’s Law is driving fundamental change. We are in the midst of a semiconductor design renaissance driven by advanced packaging.
The article comes from the observation of the semiconductor industry, author Du Qin
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
