Ultrasonic coating technology has proven to be a reliable, repeatable, and efficient method for applying a variety of chemical materials to silicon wafer surfaces for wafer and bump protection prior to dicing, grinding, and polishing. Commonly used materials include easy-to-remove chemical coatings such as Z-Coat and PMMA. Our nozzle systems can be customized to meet our customers’ specific coating requirements and challenges for dicing protective films.

Ultrasonic spray systems are proven in a wide range of applications requiring uniform, repeatable material coatings. By achieving precise thickness control from submicron to over 100 microns and the ability to coat substrates of any shape and size, these systems are an effective alternative to other technologies such as spin coating and conventional spray coating.

Key Advantages of Ultrasonic Protective Film Coating Technology:

• Fast, uniform thin film coverage of varying surface contours
• High flexibility in chemical materials and coating properties
• Clog-free atomized spraying
• Ultra-high material transfer efficiency, significantly reducing waste
• Highly repeatable, proven spray process
• Precise control of flow rate, spray velocity, and deposition volume through simple layering techniques
• Low-speed atomization technology shapes the spray into a precisely controlled pattern
• Prevents overspray, resulting in an ultra-thin, uniform coating.

Ultrasonic Coating Equipment Solutions from R&D through high volume production. Choose a product to learn more.

All of Cheersonic’s ultrasonic coating systems integrate Cheersonic ultrasonic nozzles, liquid delivery, and full system controls. Machines range from R&D tabletop systems, standalone fully enclosed programmable systems, and wide area continuous production inline systems.

The UAM series are general-purpose coating equipment, and the equipment parameters are standard parameters. If you want to know the equipment and parameters that are more suitable for your industry, you can click on the specific industries.

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