Photoresist Ultrasonic Coating System

The new photoresist ultrasonic coating system has been designed specifically to meet the unique challenges of coating high aspect ratios and deep well topographies such as MEMS wafers with photoresist. Cheersonic has extensive application expertise in depositing photoresist onto MEMS and other semiconductor wafer substrates.

The ultrasonic coating system replaces traditional spin coating equipment, providing more uniform coverage of side walls in difficult to coat applications. Ultrasonic spray has been used for photoresist deposition for years, and is a well proven method for semiconductor lithography manufacturing.

Our ultrasonic coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Our company Cheersonic focuses on ultrasonic technology for more than 20 years. We provide a Series of standard ultrasonic machines but also customized solution for function coating industry, such as new energy, electronic, medical, nano etc. We are glade to cooperate with companies in the energy industry to develop new solution for new energy industry and get a win-win station.

Chinese Website: Cheersonic Provides Professional Coating Solutions