MEMS Wafer Photoresist Ultrasonic Spraying

MEMS Wafer Photoresist Ultrasonic Spraying – Cheersonic

Over the past decade, photoresist coatings have been sprayed directly onto MEMS wafers and other 3D microstructures, and the advantages of spray deposition to 3D topography have been extensively studied.

Compared with traditional spin coating, photoresist coating by ultrasonic spraying has advantages in depositing a more uniform coating, especially on top of the sidewalls of high aspect ratio trenches and V-groove structures, which cannot be deposited by centrifugal spin A uniform coating forms a uniform film along the sidewalls without depositing excess photoresist on the bottom of the cavity.

Ultrasonic spraying is a simple, economical and repeatable process for photoresist coating in lithographic wafer processing. Ultrasonic coating systems use advanced layering techniques to finely control flow rate, coating rate and deposition volume. Low velocity spray shaping defines the atomized spray as a precise, controlled pattern, avoiding overspray while producing a very thin, uniform layer. Direct spraying using ultrasonic technology has proven to be a reliable and effective method for depositing photoresist onto 3D microstructures, reducing equipment failures caused by over-exposure of metals to etchant.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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