Printed Circuit Board Spray Fluxing The original developer of ultrasonic spray fluxing technology leads worldwide precision flux deposition for printed circuit board assembly. This ground-breaking coating technique created universal standards for accurate material application: it yields cleaner solder connections, improves top fillet geometry, and slashes flux material waste by up to 90%. Factories globally deploy this coating technology for wave and selective soldering flux processes, [...]

Ultrasonic Spray Photoresist Coating for MEMS Wafers Ultrasonic spray of photoresist for MEMS wafers and other substrates with varying topographiesFor over ten years, researchers have carried out direct photoresist spraying on MEMS wafers, silicon substrates and assorted three-dimensional microstructures. Extensive studies have validated the merits of this deposition technique when filling deeply etched, tall surface relief structures with photoresist. Compared with traditional spin coating methods, [...]

Sensor Coatings Ultrasonic Thin Film Coating Solutions for Sensor Fabrication Ultrasonic spray equipment delivers premium thin film coatings on sensor components with functional nanoparticle blends, polymer materials, conductive polymer coating formulations and oxide compound mixtures. This contact-free coating technology generates even thin film layers on diverse sensor base materials, featuring highly regulated film thickness spanning nanoscale coatings up to dozens of microns. Real-time closed-loop monitoring [...]

Microelectronic Coating Ultrasonic coating equipment delivers high-precision thin layer deposition tailored to sophisticated microelectronic hardware and assorted electronic parts. The equipment handles a wide range of coating materials, ranging from photoresist thin layers and conductive polymer coatings to electromagnetic interference shielding layers and soldering flux films used in high-end packaging processes. These coating setups generate evenly distributed coating layers while boasting outstanding material utilization rate, [...]

Photoresist Deposition for Microelectronics Photoresist Deposition onto Unconventional Substrates for Microelectronics Manufacturing Spin coating technology faces major limitations when applied to oversized, curved and specially shaped substrates in microelectronic fabrication. As an alternative, ultrasonic spray coating technology is capable of forming highly uniform and conformable photoresist films on the full surface and microstructures of such unconventional substrates. It facilitates high-precision photolithographic processing for [...]

Panel Level Packaging (PLP) Panel-Level Packaging Advanced Photoresist Coating Solutions for Semiconductor Panels With advanced packaging technology shifting from wafer-based processing to oversized panel manufacturing formats, conventional spin coating can no longer deliver even photoresist coverage on expansive rectangular substrates. Ultrasonic spray coating technology delivers an accurate, mass-producible deposition method to form evenly distributed photoresist thin films on panel packaging substrates, applicable to [...]