Ultrasonic Ni-sprayed Cu Substrates
Ultrasonic Ni-sprayed Cu Substrates Effect of ultrasonic Ni-sprayed Cu substrates on the microstructures and properties of composite interconnection joints With the rapid development of the electronic packaging industry, the optimization of lead-free solder performance has become a research hotspot. The traditional way of improving solder performance by doping particles is no longer sufficient to meet high-end production needs. The existing ultrasonic and magnetic field assisted welding technologies can [...]

