Photoresist for Panel-Level Packaging Photoresist for Panel-Level Packaging | Key Material for Advanced Packaging Lithography As advanced semiconductor packaging evolves toward large-area, high-density, and low-cost heterogeneous integration, Panel-Level Packaging (PLP) has emerged as a key technological pathway to complement and optimize traditional wafer-level packaging. Unlike circular wafer packaging, PLP utilizes large rectangular panel substrates, integrating hundreds or even thousands of chip units in a single batch, thereby significantly [...]