Wave Soldering Flux Spraying : Ultrasonic Flux Spraying for Printed Circuit Board Manufacturing Ultrasonic flux spraying, with its high precision and uniformity, has become a key technology for meeting the demands of high-density, fine-pitch PCB soldering in wave soldering processes for printed circuit board (PCB) manufacturing. It uses ultrasonic vibrations to efficiently atomize and precisely apply flux, effectively addressing the shortcomings of traditional spraying methods in [...]

Selective Flux Coating : Ultrasonic Flux Coating Systems for Selective Wave Soldering The ultrasonic selective flux coating system is an advanced, high-precision automated device designed specifically for the selective soldering process in electronics manufacturing. It replaces the traditional spray or foaming process used in wave soldering, as well as manual application methods. The core principle is to use ultrasonic energy to atomize liquid flux into extremely [...]

Flip Chip Flux Spraying : Providing Precision Flux Spraying for Flip Chip Packaging Ultrasonic selective spraying technology is a proven technology for PCB flux coating. Its core advantage lies in its ability to precisely apply a highly uniform thin film of flux to the target area while achieving minimal overspray and eliminating nozzle clogging. Leveraging our long-standing expertise in precision spraying, we have developed an inline [...]

EMI Shielding Spray Coating : Package-Level EMI Shielding Protective Coating Ultrasonic spraying technology, combined with a low-temperature thermal curing process, offers a cost-effective alternative to expensive sputtering equipment for package-level EMI shielding. High-performance silver-based EMI shielding spray materials are applied in mobile device production using a fully automated XYZ motion-controlled spray system. This system can be configured for in-line transfer mode to meet high production [...]

Protective Film Coating Ultrasonic coating technology has proven to be a reliable, repeatable, and efficient method for applying a variety of chemical materials to silicon wafer surfaces for wafer and bump protection prior to dicing, grinding, and polishing. Commonly used materials include easy-to-remove chemical coatings such as Z-Coat and PMMA. Our nozzle systems can be customized to meet our customers' specific coating requirements and challenges for [...]