Spray Type Wafer Cleaning Machine for Semiconductor

In the semiconductor manufacturing process, the cleanliness of the wafer surface directly affects device yield and performance. Spray type wafer cleaning machines for semiconductor manufacturing have become key equipment from research and development to mass production scenarios due to their multidimensional process adaptability and high-precision cleaning capabilities. This device can cover the cleaning needs of 2-12 inch full specification wafers. Whether it is small-sized R&D wafers or large-sized production wafers, it can achieve stable clamping and precise cleaning through modular stage design, adapting to diverse application scenarios in different process stages.

Its core cleaning performance is reflected in its strong ability to remove small pollutants. After optimizing the process, the number of particles on the wafer surface can be controlled within ≤ 5 per chip, and the particle size can be accurately intercepted up to ≤ 0.08 μ m. However, the actual value will be affected by cleaning process parameters (such as spray time, solvent ratio) and the original degree of wafer contamination – for example, for wafers with a lot of photoresist residue, specific organic solvents need to be used and the cleaning cycle needs to be extended to ensure deep removal of particles and pollutants. At the same time, the content of metal pollutants can be reduced to ≤ 1 × 10 ¹⁰ atoms/cm ², far below the strict threshold for metal impurities in advanced processes, effectively avoiding the interference of metal ions on the electrical performance of semiconductor devices.

The operating parameter design of the equipment provides hardware support for efficient cleaning. A high-pressure spray system with a spray pressure of ≥ 0.6MPa can use directed water flow to impact small gaps on the wafer surface, peel off stubborn pollutants attached, and avoid damage to the wafer surface caused by high pressure; The spindle speed can be flexibly adjusted within the range of 400~3000r/min. Low speed (400~800r/min) is suitable for fine cleaning of fragile wafers to prevent wafer damage caused by excessive centrifugal force. High speed (2000~3000r/min) can be combined with high-pressure spraying to achieve rapid dehydration and pollutant discharge, improving cleaning efficiency.

In terms of solvent compatibility, the equipment can adapt to various cleaning media such as deionized water, acidic solutions, alkaline solutions, and organic solvents (such as acetone and isopropanol). Among them, deionized water is often used for basic dust removal and pre cleaning to avoid excessive use of chemical solvents; Acidic solutions (such as dilute hydrochloric acid) can effectively remove metal oxide pollutants, while alkaline solutions (such as ammonium hydroxide) are suitable for the decomposition of photoresist residues. Organic solvents such as acetone and isopropanol can efficiently dissolve organic pollutants, meeting the special cleaning needs of different types of pollution.

More importantly, the equipment has a full process programmable control function, and operators can preset key indicators such as the type of cleaning liquid, spray duration, spindle speed, pressure parameters, etc. through the control system to form a customized cleaning plan. For example, for highly polluted wafers, a multi-step process of “deionized water pre flushing → alkaline solution soaking → high-pressure spraying → acidic solution neutralization → isopropanol dehydration” can be set up, and the time and parameters of each step can be precisely controlled to ensure the stability of the cleaning effect and adapt to the differentiated requirements of different processes for wafer cleanliness, providing strong support for the fine and standardized production of semiconductor manufacturing.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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