About Spray Coating on Silicon Wafers
About Spray Coating on Silicon Wafers – Photoresist Coating Systems – Cheersonic
Spraying on silicon wafers is an important semiconductor manufacturing process, mainly used to form various functional coatings on the wafer surface. The following is an overview of spraying on silicon wafers:
Purpose of spraying
- Forming photoresist layer: photoresist is a key material used for pattern transfer in semiconductor manufacturing. By spraying photoresist, a uniform thin film can be formed on the surface of silicon wafers, providing a foundation for subsequent photolithography processes.
- Preparation of insulation layer: Spraying insulation materials such as silicon dioxide (SiO ₂), silicon nitride (Si ∝ N ₄), etc. can form an insulation layer on the wafer, which is used to isolate different circuit components, prevent leakage and signal interference.
- Making metal conductive layer: Spraying metal materials such as aluminum (Al), copper (Cu), etc. can form a conductive layer on the wafer, which is used to connect circuit components and achieve electronic signal transmission.
- Enhancing surface performance: Spraying some special materials can enhance the surface performance of wafers, such as anti reflective coatings that can reduce light reflection and improve lithography accuracy; Wear resistant coatings can protect the surface of wafers from damage during processing.
Spraying method
- Rotating spraying: This is one of the most common methods of silicon wafer spraying. Fix the wafer on the rotating table, and then spray a solution of photoresist or other materials onto the center of the wafer through a nozzle. As the wafer rotates at high speed, the solution is uniformly distributed on the surface of the wafer under the action of centrifugal force, forming a uniform thin film. The advantage is that it can form a coating with uniform thickness and smooth surface, suitable for large-scale production.
- Spray spraying: the solution is atomized into tiny droplets by ultrasonic spraying, and then the droplets are sprayed onto the wafer surface. This method can form thinner coatings and is suitable for processes that require higher coating thickness. The advantage is that it can control the size and distribution of droplets, thereby achieving precise control of coating thickness and uniformity.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
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