Flip Chip Flux Spraying : Providing Precision Flux Spraying for Flip Chip Packaging
Ultrasonic selective spraying technology is a proven technology for PCB flux coating. Its core advantage lies in its ability to precisely apply a highly uniform thin film of flux to the target area while achieving minimal overspray and eliminating nozzle clogging. Leveraging our long-standing expertise in precision spraying, we have developed an inline spraying system suitable for high-volume flip chip flux coating. Ultrasonic spraying provides a precise, repeatable, and controllable solution for applying flux to contact pads. The ultra-thin, uniform flux layer it deposits effectively prevents excess residue and underfill, leading to product reliability issues. Precise control of flux thickness also prevents chip drift, which can lead to equipment downtime and poor connections. The extremely low overspray rate prevents flux contamination of surrounding passive components. Other methods, such as dispensing, dipping, and pressure nozzle spraying, struggle to achieve such a fine, targeted layer. The system achieves high throughput through automated XYZ motion control and a conveyor configuration, and spray efficiency can be further enhanced through a multi-nozzle layout. This automated spray system has been extensively proven in production lines worldwide.
Advantages of using ultrasonic spraying in flip-chip packaging applications:
- Precise and controllable spraying: Effectively avoids rework costs caused by overspray.
- Precise and adjustable thickness: Excellent control of flux coating thickness, down to 20 microns.
- Uniform and stable coating: A uniform flux layer eliminates the risk of chip drift and prevents chip and substrate scrap.
- Strong substrate compatibility: The system can accommodate a variety of substrate configurations.
- Anti-clogging and maintenance-free: Ultrasonic nozzles are resistant to clogging, requiring minimal cleaning, and offer stable and repeatable spray performance, overcoming the performance degradation associated with pressure nozzles due to gradual clogging.
- Excellent material compatibility: Validated for compatibility with indium-based flux.

ULTRASONIC COATING EQUIPMENT SOLUTION
Ultrasonic Coating Equipment Solutions from R&D through high volume production. Choose a product to learn more.
All of Cheersonic’s ultrasonic coating systems integrate Cheersonic ultrasonic nozzles, liquid delivery, and full system controls. Machines range from R&D tabletop systems, standalone fully enclosed programmable systems, and wide area continuous production inline systems.
The UAM series are general-purpose coating equipment, and the equipment parameters are standard parameters. If you want to know the equipment and parameters that are more suitable for your industry, you can click on the specific industries.
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Tel: 0571-87910406
- Mobile: +86 13588732518
- Email: Market2@cheersonic.com
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