TGV Patterned Coating Technology
TGV Patterned Coating Technology | Ultrasonic Spraying System Achieves Precise Coating of Via Edges
In the advanced Through Glass Via (TGV) packaging process, the coating of via edge is a key procedure that determines the insulation, tightness and stability of chip packaging. Traditional spraying processes are plagued by coating accumulation, uneven film thickness, edge missing coating and inner hole contamination, which cannot meet the high-precision coating requirements of TGV micro-holes. Ultrasonic spraying technology has become a core solution for TGV graphical spraying and precise via edge coating due to its advantages of precise atomization and controllable deposition.
TGV spraying adopts a precise graphical spraying mode. Different from the traditional full-coverage spraying process, it can customize the spraying trajectory and area according to the TGV substrate circuit layout, micro-hole aperture and pitch parameters, realizing selective fixed-point, fixed-quantity and fixed-shape coating. It accurately avoids non-spraying areas and fully adapts to the refined TGV packaging process. Without high-pressure air flow, it achieves micron-level uniform liquid atomization through high-frequency piezoelectric vibration, eliminating uneven atomization and material splashing of traditional processes.
For the core difficulty of precise TGV via edge coating, ultrasonic spraying realizes efficient application through multi-dimensional precision control. The equipment stably produces uniform micro-droplets with a particle size of 10-50μm. The droplets have low kinetic energy and settle gently without bouncing, ensuring full coverage of via edges without coating accumulation and burrs. Supported by accurate flow control and trajectory algorithm, it maintains uniform film thickness for high-aspect-ratio TGV micro-holes, realizing consistent coating on via edges, hole walls and substrate surfaces.
This technology is compatible with various insulating and passivation materials such as PI, SiO₂ and Si₃N₄. The formed dense and uniform coating realizes circuit isolation, water vapor barrier and stress buffering, avoiding short circuit, oxidation and stress cracking caused by coating defects, and improving the yield and long-term reliability of glass substrate packaging. It is widely used in advanced semiconductor packaging and micro-nano device precision coating.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
If you have any technical questions, customization demands, or procurement inquiries about ultrasonic atomization nozzles, feel free to contact our professional sales and technical team for detailed parameters, customized solutions, and industry application support.
Email: market2@cheersonic.com
