Spraying Photoresist onto Silicon Wafers
Ultrasonic sprayer multi-nozzle technology: Overcoming the problem of uniformity of photoresist spraying on square silicon wafers
In the field of semiconductor manufacturing and micro-nano processing, the accuracy of photoresist spraying on 210*210mm square silicon wafers directly determines the performance and yield of chips and precision devices. Traditional spraying methods are difficult to meet the uniform film formation requirements of large-area silicon wafers, while ultrasonic sprayers, with their innovative design of multi-nozzle collaborative operation, have brought revolutionary breakthroughs in photoresist spraying on square silicon wafers.
When traditional photoresist spraying equipment processes 210*210mm square silicon wafers, the single-nozzle spraying efficiency is low, and it is difficult to ensure the uniformity of the coating on the entire silicon wafer surface. Due to differences in spraying distance and angle, the edge and center areas of the silicon wafer are prone to uneven photoresist thickness, resulting in deformation of subsequent photolithography patterns and reduced resolution, which ultimately causes chip performance defects or device scrapping. Ordinary multi-nozzle equipment often has problems such as poor nozzle coordination and different sizes of atomized particles, and also cannot meet the requirements of high-precision spraying.
The multi-nozzle system of the ultrasonic sprayer is composed of multiple precise ultrasonic nozzles arranged scientifically. Each nozzle can independently adjust the ultrasonic frequency, glue spray flow rate and other parameters. High-frequency ultrasound atomizes the photoresist into particles with extremely small and uniform diameters. Under the dispatch of the intelligent control system, multiple nozzles work together to spray 210*210mm square silicon wafers from different angles and positions. The spacing between nozzles and the spraying trajectory are precisely calculated to ensure that the photoresist particles are evenly deposited on the surface of the silicon wafer, effectively eliminating the edge effect and center deviation.
In terms of film uniformity, the ultrasonic sprayer performs excellently. Through an advanced closed-loop feedback control system, the thickness distribution of the photoresist on the surface of the silicon wafer is monitored in real time, and the spraying parameters of each nozzle are automatically adjusted according to the monitoring data. After professional testing, on a 210*210mm square silicon wafer, the thickness error of the photoresist film sprayed by the ultrasonic sprayer can be strictly controlled within ±2 microns, and the uniformity is far superior to traditional equipment. This highly uniform photoresist film makes the transfer of photolithography patterns more accurate, improves the accuracy of chip critical dimensions (CD) by 30%, and greatly improves product yield.
In addition, the multi-nozzle design significantly improves the spraying efficiency. Compared with single-nozzle equipment, the ultrasonic sprayer shortens the operation time of photoresist spraying on 210*210mm square silicon wafers by nearly half, effectively speeding up the production rhythm. Its non-contact spraying characteristics avoid physical contact between the nozzle and the surface of the silicon wafer, prevent damage to the silicon wafer, and protect its original flatness and cleanliness. CHEERSONIC continues to upgrade the technology of ultrasonic sprayers, optimize the collaborative control algorithm of the multi-nozzle system, enhance the intelligence of the equipment, and ensure that every spraying operation is stable and efficient.
As the semiconductor industry develops towards higher precision and larger size, the uniformity and efficiency of photoresist spraying on 210*210mm square silicon wafers are becoming increasingly stringent. The multi-nozzle technology of ultrasonic spraying machine, with its outstanding advantages in uniform film formation and efficient operation, will surely become the core process equipment in the field of semiconductor manufacturing and micro-nano processing, and promote the industry to a new level of development.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
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