Spray Photoresist

Ultrasonic spray photoresist technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than the traditional spin coating in terms of microstructure wrapping and uniformity Craft.

The ultrasonic spraying system can precisely control the flow rate, coating speed and deposition volume. Low-speed spray shaping defines atomized spray as a precise and controllable pattern to avoid excessive spray when producing a very thin and uniform layer. The ultrasonic spray system can control the thickness from sub-micron to more than 100 microns, and can coat any shape or size.

Ultrasonic Photoresist Deposition onto Unconventional Substrates for Microelectronics Manufacturing

With the rapid iteration of advanced microelectronics manufacturing, the demand for photolithography processing on diverse unconventional substrates continues to grow, covering curved surfaces, flexible materials, large-size panels and three-dimensional microstructure carriers. Traditional spin coating technology, the mainstream photoresist deposition method in conventional wafer processing, relies on centrifugal force to spread photoresist liquid, which exposes prominent limitations in the processing of special-shaped substrates. It suffers from severe material waste, uneven film thickness, edge bead accumulation and poor sidewall coverage of microstructures, seriously restricting the precision and yield of advanced microelectronic device fabrication.

Ultrasonic photoresist deposition has emerged as a reliable alternative and innovative process to address the above technical bottlenecks. This technology utilizes high-frequency ultrasonic vibration to atomize photoresist into uniform micron-scale tiny droplets, which settle gently on the substrate surface in a non-contact manner. Different from spin coating, it does not depend on centrifugal force, thus eliminating coating defects caused by gravity and rotational speed differences. The process achieves high-uniformity and conformal photoresist film deposition on various complex unconventional substrates, with coating uniformity exceeding 95% and greatly improved material utilization rate.

Furthermore, ultrasonic deposition supports flexible adjustment of film thickness from nanometers to micrometers by optimizing ultrasonic power, spraying speed and solution concentration. It maintains stable coating performance on irregular surfaces and microgroove structures, meeting the high-precision lithography requirements of MEMS devices, advanced semiconductor packaging and flexible electronic components. This low-damage, high-precision and high-efficiency deposition technology effectively breaks the substrate limitation of traditional photoresist processes, providing a crucial technical support for the batch manufacturing of next-generation diversified microelectronic devices.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

The Company’s solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Cheersonic’s growth strategy is focused on leveraging its innovative technologies, proprietary know-how, unique talent and experience, and global reach to further develop thin film coating technologies that enable better outcomes for its customers’ products and processes. For further information, visit https://cheersonic-liquid.com/.