Spray Fluxer
Today will focus on the latest improvements of ultrasonic spray fluxer design. The new ultrasonic atomizing nozzle is used in both UFM4000L and UFM6000 equipment, and incorporates an air filling system that drives the flux droplets to the PCB to achieve high uniformity and uniformity. The new ultrasonic spray fluxer further improves the design through the following aspects:
• Improve equipment maintainability and reduce maintenance costs.
• Improved corrosion resistance, using corrosion-resistant materials, has better chemical resistance, and also has high temperature heat resistance.
• Improved ease of cleaning and easy cleaning.
• The spraying pattern has higher precision, achieving high uniformity and uniformity.
As a R&D and manufacturer dedicated to ultrasonic spray flux systems, Cheersonic continues to provide innovative solutions for wave soldering manufacturing and provides continuous world-class services and support for all its ultrasonic spray flux equipment.
Ultrasonic fluxing systems for selective wave solder process
Ultrasonic fluxing systems have emerged as a high-efficiency, precision-driven core solution for modern selective wave solder processes, effectively overcoming the inherent drawbacks of traditional pressure spraying and foam fluxing technologies in electronic manufacturing. Dedicated to targeted flux deposition on designated PCB soldering areas, these advanced systems leverage high-frequency ultrasonic vibration to atomize liquid flux into uniform, micron-sized fine droplets, forming a soft and low-velocity mist without relying on high air pressure or fluid extrusion.
This working principle eliminates common issues such as nozzle clogging, uneven coating and excessive overspray that plague conventional fluxing equipment. It delivers extremely consistent flux coverage on tiny solder pads, through-hole components and complex PCB layouts, drastically reducing flux waste by up to 93% compared with traditional methods. Compatible with all types of commercial fluxes including rosin-based and OA fluxes, the system features stable operation and minimal maintenance requirements, greatly improving production continuity.
Equipped with programmable multi-axis positioning and visual area recognition functions, automated ultrasonic fluxing systems achieve precise selective flux application, avoiding unnecessary flux residue on non-soldering regions. By ensuring clean, uniform flux layers, it optimizes solder wetting, minimizes cold solder joints, bridging and voids, and significantly enhances soldering reliability. Ideal for high-precision, high-mix PCB assembly lines, it has become an indispensable technology for upgrading selective wave solder processes in precision electronics manufacturing.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
The Company’s solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
Cheersonic’s growth strategy is focused on leveraging its innovative technologies, proprietary know-how, unique talent and experience, and global reach to further develop thin film coating technologies that enable better outcomes for its customers’ products and processes. For further information, visit https://cheersonic-liquid.com/.
