Silicon Carbide Industry Chain

Silicon Carbide Industry Chain – Coating Semiconductor Wafers – Cheersonic

The industrial chain based on silicon carbide materials mainly includes the preparation of silicon carbide substrate materials, the growth of epitaxial layers, device manufacturing and downstream application markets. On the silicon carbide substrate, the chemical vapor deposition method (CVD method) is mainly used to generate the required thin film material on the surface of the substrate, that is, to form an epitaxial wafer to further fabricate the device.

1. Semi-insulating silicon carbide substrate

Semi-insulating silicon carbide substrates are mainly used in the manufacture of gallium nitride radio frequency devices. By growing a gallium nitride epitaxial layer on a semi-insulating silicon carbide substrate, a silicon carbide-based gallium nitride epitaxial wafer is prepared, and a gallium nitride radio frequency device can be further fabricated.

2. Conductive silicon carbide substrate

Conductive silicon carbide substrates are mainly used in the manufacture of power devices. Different from the traditional silicon power device manufacturing process, silicon carbide power devices cannot be directly fabricated on silicon carbide substrates. It is necessary to grow a silicon carbide epitaxial layer on a conductive substrate to obtain a silicon carbide epitaxial wafer, and manufacture various types of power on the epitaxial layer. device.

The ultrasonic coating system can use advanced layering technology to precisely control the flow rate, coating speed and deposition amount. Low-speed spray forming defines an atomizing spray as a precise, controllable pattern, avoiding excessive spraying when producing very thin and uniform layers. It turns out that direct spraying using ultrasonic technology is a reliable and effective way to deposit photoresist on 3D microstructures, thereby reducing equipment failures caused by excessive metal exposure to etchant.

Ultrasonic spray systems have proven to be suitable for a variety of applications that require uniform, repeatable photoresist or polyimide film coatings. Cheersonic’s coating system can control thicknesses from sub-micron to more than 100 microns, and can coat any shape or size. It is a feasible alternative to other coating technologies such as spin coating and traditional spray coating.

Cheersonic’s non-blocking ultrasonic coating technology is known for its ultra-thin micron-layer coatings of functional and protective materials. The ultrasonic vibration of the nozzle effectively dispersed the particles in the suspension and produced a very uniform particle dispersion in the film layer, while the conductive particles did not settle out of the suspension.