Photosensitive Polyimide Coating System

Photosensitive Polyimide Coating System – Ultrasonic Coating – Cheersonic

Photosensitive polyimide is a kind of organic material with both imide ring and photosensitive gene on the polymer chain, which has excellent thermal stability, good mechanical properties, chemical and photosensitivity.

Photosensitive polyimide has two main functions in the field of electronics: photoresist and electronic packaging. Adding sensitizers, stabilizers, etc. to photosensitive polyimide can obtain “polyimide photoresist”.

Compared with traditional photoresist, photosensitive polyimide photoresist does not need to be coated with photoblocking agent, which can greatly reduce the processing steps. At the same time, photosensitive polyimide is also an important electronic packaging adhesive. Photosensitive polyimide can be used as a packaging material for: buffer coating, passivation layer, α-ray shielding material, interlayer insulation material, chip packaging material, etc. It is also widely used in the microelectronics industry, including the packaging of integrated circuits and multi-chip packages.

Another function of photosensitive polyimide is as an advanced electronic packaging resin. As electronic products become smaller, thinner, more high-performance, more multifunctional, more reliable and less expensive, market demand has increased the density of integrated circuit packaging, and the requirements for IC packaging materials have also increased. With the advent of the era of large chips, the original metal and ceramic material packaging process technology has been greatly impacted, and electronic packaging materials represented by epoxy resins and polyimide resins are gradually emerging as important IC packaging materials.

Photosensitive polyimide can be used as a packaging material for: buffer coating, passivation layer, α-ray shielding material, interlayer insulation material, chip packaging material, etc. It is also widely used in the microelectronics industry, including integrated circuits (ICs) and multi-chip packages (MCPs).

Ultrasonic spraying systems have been proven to be used in various applications that require uniform and repeatable photoresist or polyimide film coatings. The thickness control range is from submicron to more than 100 microns, and any shape or size can be coated.

Ultrasonic spraying technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than the traditional spin coating in terms of microstructure wrapping and uniformity Craft.

The ultrasonic spraying system can precisely control the flow rate, coating speed and deposition volume. Low-speed spray shaping defines atomized spray as a precise and controllable pattern to avoid excessive spray when producing a very thin and uniform layer. The ultrasonic spray system can control the thickness from sub-micron to more than 100 microns, and can coat any shape or size.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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