Photosensitive Polyimide

Photosensitive polyimide is a kind of organic material with imine ring and photosensitive gene on the polymer chain, which has excellent thermal stability, good mechanical properties, chemical and photosensitive properties.

In the electronic field, photosensitive polyimide mainly has two major functions of photoresist and electronic packaging. Adding sensitizers and stabilizers to photosensitive polyimide can obtain “polyimide photoresist”.

Compared with traditional photoresists, photosensitive polyimide photoresists do not need to be coated with photoblockers, which can greatly reduce the processing steps. At the same time, photosensitive polyimide is also an important electronic packaging adhesive. As a packaging material, photosensitive polyimide can be used for: buffer coating, passivation layer, α-ray shielding material, interlayer insulating material, chip packaging material, etc., and is also widely used Used in the microelectronics industry, including the packaging of integrated circuits and multi-chip packages.

Another role of photosensitive polyimide is as an advanced electronic packaging resin. With the miniaturization, thinning, high performance, multi-functionality, high reliability and low cost of electronic products, the market demand has increased the packaging density of integrated circuits, and the requirements for IC packaging materials have also increased. With the advent of the era of large chips, the original packaging technology of metal and ceramic materials has been greatly impacted. Electronic packaging materials represented by epoxy resin and polyimide resin are gradually emerging as important IC packaging materials. Material.

Photosensitive polyimide can be used as a packaging material: buffer coating, passivation layer, α-ray shielding material, interlayer insulating material, chip packaging material, etc., and is also widely used in the microelectronics industry, including integrated circuits (ICs) and multi-chip packages (MCPs).

Ultrasonic spray systems have proven useful in a variety of applications requiring uniform, repeatable coatings of photoresist or polyimide films. Thickness control ranges from submicron to over 100 microns and is capable of coating any shape or size.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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