Photoresist Coating Onto Semiconductor Wafers

We have many ultrasonic spray coating systems, this machine can be used for photoresist coating onto the semiconductor wafers, square substrates.

Ultrasonic spraying technology is used for semiconductor photoresist coating. Compared with traditional coating processes such as spin coating and dip coating, it has the advantages of high uniformity, good encapsulation of microstructures, and controllable coating area. In the past 10 years, it has been fully demonstrated that the 3D microstructure surface photoresist coating using ultrasonic spraying technology, the prepared photoresist coating is significantly higher than the traditional spin coating in terms of microstructure wrapping and uniformity Craft.

Cheersonic Ultrasonic Coating technology were getting more and more popular among electronics and semiconductor market. Cheersonic ultrasonic coating equipment have been growing very quickly in the local and international markets, for now, there are almost 40 countries (universities, institutes, labs etc) installed the up-to-date ultrasonic coating machines from Cheersonic.