Photoresist Coating Techniques
Photoresist Coating Techniques Ultrasonic Photoresist Coating Techniques utilize high-frequency vibrations to enhance photoresist uniformity and adhesion during semiconductor manufacturing. This advanced method ensures precise thin-film deposition, reduces defects, and improves process efficiency for microelectronic device fabrication. Through the utilization of ultrasonic atomization technology, the photoresist, which is laden with an adequate amount of solvent, is fragmented and transformed into minuscule droplets, typically in the micrometer scale. These atomized [...]