IC Cover Ink Spray Scheme

Core advantages of ultrasonic spraying (compared to traditional spraying)

1. Ultra high uniformity
– Atomized particle size: 5-50 μ m (adjustable), CV value<5%
– Film thickness control accuracy: ± 1 μ m (applicable to 2-20 μ m coatings)

2. Material utilization rate>95%
– Directional spraying reduces overspray and saves high cost ink (such as PI, epoxy resin)

3. Zero solvent damage risk
– Low temperature atomization (<40 ℃) to protect heat sensitive IC components

4. Complex structure coverage
– Excellent slit penetration, suitable for full coverage of chip edges/pin areas

Design of key process parameters

– Atomization frequency: 60-120 kHz (controlled particle size)
– Ink viscosity: 10-50 cP (requires preheating to 40 ℃)
– Spray height: 50-100 mm (anti droplet polymerization)
– Movement speed: 1-10 mm/s (adjust film thickness)
– Air pressure: 0.1-0.3 MPa (atomization auxiliary airflow)

Key points for equipment selection

1. Nozzle module
– Multi channel array (covering 300mm wafers requires ≥ 8 nozzles)
– Anti clogging titanium alloy nozzle (aperture 0.1mm)

2. Sports system
Linear motor platform (repeated positioning accuracy ± 5 μ m)
– Six axis robotic arm (suitable for irregular substrates)

3. Environmental control
– Class 1000 cleanroom (temperature and humidity control ± 1%)
– Static elimination device (＜ 100V)

4. Online monitoring
– Real time film thickness sensor (laser interferometer)
– Automatic viscosity compensation system

A specialized solution for IC cover ink

1. Low tension ink adaptation
– Surface tension should be less than 30 dyn/cm (it is recommended to add 0.1% fluorine based leveling agent)

2. Staircase covering process
– First layer thin coating (3 μ m) → pre curing → secondary spraying → final curing

3. Edge protection
– Focusing nozzle compensates for twice the spraying amount in the pin area

4. Curing compatibility
– UV curing: 365nm wavelength, energy density 80mJ/cm ²
– Thermal curing: step heating (80 ℃ → 150 ℃/N ₂ environment)

Cost benefit analysis

– Ink loss rate: Traditional spraying 40-50% → Ultrasonic spraying<5%
– Yield rate: Traditional spraying 85-90% → Ultrasonic spraying 98%+
– Equipment maintenance cycle: Traditional spraying for 200 hours → Ultrasonic spraying for 1000 hours
– Comprehensive cost (5 years): Traditional spraying is 35% higher → Ultrasonic spraying is the benchmark

Conclusion: Ultrasonic spraying achieves high-precision coating control in IC cover process, especially suitable for high-value chip manufacturing. It is recommended to choose modular equipment compatible with future large-sized chips (such as>500 × 500mm).

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Chinese Website: Cheersonic Provides Professional Coating Solutions