The difference between hard mirrors and soft mirrors Endoscopes can be divided into rigid and flexible endoscopes. 01 Differences in application fields Generally speaking, the cavity is more suitable for rigid scope, and the tube is more suitable for soft scope. Rigid endoscopes mainly enter sterile human tissues and organs or enter sterile chambers of the human body through surgical incisions, such as laparoscopy, thoracoscopy, arthroscopy, intervertebral discoscopy, [...]

What role can artificial intelligence play in cloud computing? What role can artificial intelligence play in cloud computing? Cheersonic With the rise of artificial intelligence, everyone has high hopes for its future. In the case of cloud computing, mentions of it started in the late 1990s. However, modern cloud computing was first proposed by Amazon in 2006. If business owners start to apply the concept of cloud computing, [...]

Why is the automotive industry still lacking cores? Why is the automotive industry still lacking cores? Cheersonic For South Korean automakers, there is no sign that the chronic shortage of automotive semiconductors will ease this year. Those who bought a new Genesis, for example, have been told that if they're lucky, the car will take six to 12 months to deliver. GM's second Buypeong plant in Incheon cut [...]

The semiconductor boom is far from over The semiconductor industry is notorious for its ups and downs because of a boom and bust cycle every 4 or 5 years. At present, the expansion plans of large wafer manufacturers at every turn of 100 billion have exacerbated cycle concerns. However, the bottleneck of equipment capacity and the huge demand for cores for all things will greatly prolong this prosperity [...]

Three methods of 3D chips Three methods of 3D chips - Ultrasonic Nozzle Spray - Cheersonic For several years, system-on-chip developers have started breaking down their ever-larger designs into smaller chiplets and linking them together within the same package, effectively increasing silicon area among other benefits. In CPUs, these links are mostly so-called 2.5D, where chiplets are placed next to each other and connected using short, dense interconnects. [...]