coating equipment solutions - ultrasonic atomization

25 05, 2026

Semiconductor Photoresist for Back-End Packaging

Semiconductor Photoresist for Back-End Packaging Photoresist is not only used in front-end chip manufacturing, but also has its own category in advanced packaging. It is a key material supporting chip miniaturization, high performance, and low power consumption. The core of advanced packaging is to shorten chip interface spacing and interconnect length, increase interface density, and achieve heterogeneous integration of multiple chips. Bumps and redistribution layers (RDLs) are two [...]

24 05, 2026

Applications of Photoresist in Advanced Packaging of Integrated Circuits

Photoresist Applications in IC Advanced Packaging Background of Advanced Packaging Technology for Integrated Circuits With the development of technologies such as 5G, artificial intelligence, and the Internet of Things, semiconductor devices are upgrading towards smaller size, faster speed, and higher energy efficiency. Advanced packaging of integrated circuits has become a core link in solving chip integration and performance challenges, and is also an important direction for continuing Moore's [...]

23 05, 2026

Ultrasonic Lens Coating System

Ultrasonic Lens Coating System Ultrasonic Lens Coating System | Thin-Film Optical | Cheersonic In the field of optical manufacturing, the precision and stability of coating processes directly determine product performance. Cheersonic's ultrasonic coating technology, through groundbreaking innovation, has created a lens coating system that combines precision and repeatability, providing functional and decorative coating solutions for various lenses, mirrors, and optical components, redefining the standards of optical coating processing. [...]

23 05, 2026

Ultrasonic Spraying Equipment Application in LCD PI Process

Ultrasonic Spraying Equipment Application in LCD PI Process Application of Ultrasonic Spraying Equipment in the PI Liquid Spraying Process of LCD Screens In the display technology field, LCD screens, with their mature processes and stable performance, are widely used in various scenarios such as consumer electronics, industrial control, and automotive displays. The production of LCD screens is a precise and complex process system, among which the preparation of [...]

22 05, 2026

Photoresist Coating Process Technology

Photoresist Coating Process Technology Photoresist Coating Process Technology - Photoresist Coating Systems - Cheersonic In the fields of semiconductors, micro/nano fabrication, MEMS devices, and flexible electronics manufacturing, photoresist coating is a core pre-process in photolithography. The uniformity of the coating, the consistency of film thickness, and the surface smoothness directly determine the pattern accuracy and yield of subsequent exposure, development, and etching. Traditional photoresist coating processes mainly include [...]

22 05, 2026

Ultrasonic Spraying for Medical TPU Catheters

Ultrasonic Spraying for Medical TPU Catheters Ultrasonic Spraying for Medical TPU Catheters - Cheersonic In modern clinical medicine, medical catheters are core devices for interventional diagnosis and treatment, and their surface properties play a decisive role in treatment safety and patient comfort. Traditional catheter surface treatment processes generally suffer from uneven coating and weak adhesion, especially for catheters that require long-term placement or contact with sensitive tissues; poor [...]

22 05, 2026

Photoresist Spraying Technology for Semiconductor Packaging

Photoresist Spraying Technology for Semiconductor Packaging Ultrasonic photoresist spraying technology empowers advanced semiconductor packaging, helping the industry improve quality, reduce costs, and increase efficiency. As semiconductor packaging technology rapidly iterates towards high density, high precision, and three-dimensional integration, photoresist, as a core material in advanced packaging, directly determines chip packaging precision, yield, and production costs through its coating quality, uniformity, and utilization rate. Traditional photoresist spin coating processes [...]

21 05, 2026

Ultrasonic Spraying for Anion Exchange Membranes

Ultrasonic Spraying for Anion Exchange Membranes Ultrasonic Spraying for Anion Exchange Membranes: Synergistic Optimization of Solution and Substrate Anion exchange membranes, as core components of energy devices such as fuel cells and water electrolyzers, directly determine device performance through their ion transport efficiency and mechanical stability. Ultrasonic spraying technology, with its advantages of uniform droplet distribution and controllable membrane thickness, has become a key method for preparing high-performance [...]

21 05, 2026

Application of Ultrasonic Coating Technology in PEM Electrolyzer Fabrication

Application of Ultrasonic Coating Technology in PEM Electrolyzer Fabrication Cheersonic supplies high-performance ultrasonic coating equipment dedicated to the production of PEM electrolyzers, which can form even and stable high-quality catalyst coatings on core components including membrane electrode assemblies, electrodes, gas diffusion layers and proton exchange membranes. The UAM6000 intelligent coating equipment adopts full-automatic large-area conveyor design, equipped with precise XYZ three-axis motion control system and mature Windows operation [...]

21 05, 2026

Ultrasonic Atomization of Freeze-Dried Microspheres

Ultrasonic Atomization of Freeze-Dried Microspheres Ultrasonic Atomization of Freeze-Dried Microspheres - Cheersonic Freeze-dried microspheres, as a novel microparticle formulation, play an irreplaceable role in various fields such as pharmaceuticals, food, and biochemicals due to their excellent stability, dispersibility, and biocompatibility. Their preparation process demands extremely high requirements for particle size uniformity, morphological integrity, and retention of active ingredients. Traditional preparation processes often struggle to balance efficiency and quality. [...]