Advanced Packaging Technology Popular Science The Post-Moore's Law Era: Advanced Packaging Becomes a Core Technology Direction 1. Moore's Law Slows Down - Wafer manufacturing physical properties are approaching their limits. The shrinking of transistor sizes has led to problems such as quantum tunneling, extending the process update cycle from 18 months to 3 years. - Advanced process R&D costs are rising sharply. The design costs of 5nm, 3nm, [...]
Ultrasonic Spraying Anti-fog Coating for Medical Mirrors Application of Ultrasonic Spraying Anti-fog Coating Technology for Medical Product Mirrors In medical diagnostic and treatment scenarios, the clarity of mirrors on medical products such as endoscope lenses, surgical microscope eyepieces, and monitor display mirrors directly affects diagnostic accuracy and patient safety. However, factors such as body temperature, temperature differences with the environment, and evaporation of bodily fluids in the medical [...]
Analysis of MIP Packaging Coatings for Light-Emitting Chips Main Coating Materials High-Transmittance Silicone Coating - Main Components: High-transmittance silicone such as polydimethylsiloxane (PDMS), refractive index ≥1.5 - Application Location: Main encapsulation layer on the chip surface, directly covering the light-emitting surface - Features: Transmittance >95%, high temperature resistance (up to 200℃), anti-aging, good insulation Black Opacifying Coating (Black Glue) - Main Components: Epoxy resin with added carbon black [...]
Application of Modified Coatings on Surgical Instrument Surfaces In the operating room under the bright lights, the moment a sharp scalpel slices through the skin, an invisible microscopic battle begins. Tissue debris adheres to the blade like chewing gum, proteins in the blood gradually corrode the metal surface, and each cut is accompanied by a loss of friction. This is not an exaggeration—traditional uncoated surgical instruments can lose [...]
Advanced Packaging Photoresist and Its Development Trends Applications of Photoresist in Advanced Packaging Photoresist, also known as photoresist material, is a core consumable in microfabrication. Its solubility changes after exposure to a light source, making it an etch-resistant material. It is an auxiliary material in advanced packaging manufacturing, primarily used for creating metal patterns in redistribution layers. After the process is complete, it is stripped away and does [...]
Ultrasonic Coating of Medical Blades Precision Coating and Ultrasonic Spraying Processes Enhance Tool Lubrication and Durability The user experience and lifespan of a cutting tool largely depend on its surface friction coefficient and wear resistance. Precision surface coating is a key process for optimizing these two properties. Applying a controllable functional lubricating coating to the tool surface during the finishing stage of tool manufacturing fundamentally improves the tool's [...]
Ultrasonic Spray Coating for Semiconductor and Dielectric Layers Ultrasonic Spray Coating Machine: Core Process Equipment for Precise Thin Film Transistor Fabrication In the current wave of miniaturization, flexibility, and high performance transformation of electronic devices, thin film transistors (TFTs), as core components in display driving, intelligent sensing, and photovoltaic energy, directly determine the performance ceiling of end products through the precision and efficiency of their fabrication process. Ultrasonic [...]
Ultrasonic Coating Non-metallic Catalyst Ultrasonic Coating Non-metallic Catalyst: Empowering precise electrocatalytic conversion of CO ₂ to methanol Under the guidance of the "dual carbon" goal, the electrocatalytic conversion of CO ₂ into high-value methanol has become one of the core pathways for carbon recycling. The efficiency bottleneck of this process has long been constrained by the coating accuracy and activity control of catalysts, and the combination of ultrasonic [...]
Ultrasonic Coating of Silicon Carbide Electronic Components Ultrasonic Coating of Silicon Carbide Electronic Components With the accelerated localization of the third-generation semiconductor industry and the upgrading of high-end electronic devices towards high power and miniaturization, silicon carbide (SiC) electronic components, with their core advantages of high voltage resistance, high frequency resistance, high thermal conductivity, and excellent high-temperature stability, have become a core support for new energy vehicles, AI [...]
Semiconductor Photoresist for Back-End Packaging Photoresist is not only used in front-end chip manufacturing, but also has its own category in advanced packaging. It is a key material supporting chip miniaturization, high performance, and low power consumption. The core of advanced packaging is to shorten chip interface spacing and interconnect length, increase interface density, and achieve heterogeneous integration of multiple chips. Bumps and redistribution layers (RDLs) are two [...]
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