PSPI Photosensitive Polyimide
PSPI Photosensitive Polyimide PSPI Photosensitive Polyimide: A Core Insulating Material for Glass Substrate Packaging, Bridging Panel Technology and Advanced Packaging As AI computing chips evolve toward higher bandwidth and greater integration, traditional packaging substrates are increasingly revealing limitations such as significant thermal deformation and high-frequency signal loss. Glass substrate packaging—leveraging advantages like low thermal expansion, low dielectric loss, and suitability for large-format panel-level carriers—has emerged as a key [...]







