Application of Thermally Conductive Insulating PI Film
In the era of highly thin, multifunctional and integrated electronic devices, it will inevitably lead to heat accumulation inside the composite material, seriously affecting the stable operation and service life of the equipment. How to achieve fast and efficient thermal conductivity and heat dissipation of dielectric materials has become a key issue affecting the development of electronic equipment. The low intrinsic thermal conductivity of traditional polyimide limits its application in electrical equipment, smart grids and other fields. The development of new high thermal conductivity polyimide dielectric film materials has become a research focus at home and abroad. This paper introduces the thermal conduction mechanism of composite materials, summarizes the research progress and development status of thermally conductive polyimide films in recent years, and focuses on the influence of thermal conductive fillers, interface compatibility, and molding process on the thermal conductivity of materials. Finally, combined with the needs of the future development of thermally conductive polyimide composite dielectric materials, some key scientific and technological issues in the research are summarized and prospected.
Polymer materials are widely used in electronics, communications, military equipment manufacturing, aerospace and other fields due to their excellent electrical insulation, chemical corrosion resistance, light weight and low density. Polyimide (PI) is an aromatic heterocyclic polymer compound constructed by imide-containing chain segments [-C(O)-N(R)-C(O)-]. It has excellent electrical insulation, radiation resistance, mechanical properties and other characteristics, and is known as a “problem solver”. PI has great development prospects as a structural or functional material, especially PI film material, which is known as the “golden film”. It is one of the earliest developed and applied polyimide products and is widely used in printed circuit boards, electronic packaging, interlayer dielectrics, display panels and other fields.
The high integration and high power of modern electronic equipment, industrial devices represented by chips, hybrid electric vehicles and light-emitting diodes have led to a gradual reduction in the size of products. The problem of exponential increase in the heat generated by this has become increasingly prominent, seriously affecting the operating performance and service life of the products. The efficient heat conduction and heat dissipation of thermal management systems have attracted more and more attention.
Related studies have shown that for every 2°C increase in the temperature of electronic equipment, the reliability decreases by 10%; for an increase of 8~12°C in temperature, the service life is halved. The thermal conductivity of materials has become an important parameter affecting the normal operation of equipment. Polymer materials have shown great potential in solving the problem of thermal conductivity and heat dissipation, but the intrinsic thermal conductivity of polyimide materials is low, usually below 0.2 W/(m·K), which is much lower than that of metals, carbon, ceramics and other materials, greatly limiting the application of PI films in high-tech fields. In order to ensure the normal operation and safety of equipment, it is of great significance to seek appropriate methods to improve the thermal conductivity of polyimide materials. In order to solve the problem of thermal conductivity and heat dissipation of polyimide materials, researchers mainly work from two aspects. First, the modification of the PI matrix, from the perspective of molecular structure design, based on the 1~3 level structure design and construction of ordered structure of PI; inducing the formation of ordered structure by mechanical stretching, shearing, centrifugation, spinning and other methods; based on the intermolecular interaction force, especially the advantage of hydrogen bonds, forming interlaced and entangled structures between molecular chains and constructing hydrogen bonds between side groups. The strategy to improve the intrinsic thermal conductivity of polyimide is to change the morphology of the matrix chain structure, make the curled molecular chain appear stretched, improve the order of chain segment aggregation, create a path for phonon transmission, and thus improve the intrinsic thermal conductivity of the matrix.
Second, taking PI as the matrix, adding high thermal conductivity fillers to the matrix is also an effective strategy to improve thermal conductivity. At present, the theoretical research and industrial production of high thermal conductivity polyimide composite materials at home and abroad are mainly concentrated on filled PI composite materials. The thermal conductive fillers are interconnected in the PI matrix to form an orderly thermal conductive path, reduce the scattering generated during phonon transmission, and realize the rapid transmission of heat.
The thermal conductivity of the composite material is determined by the structure of the PI matrix and the performance of the filler, the arrangement of the filler in the matrix, and the interaction between the matrix and the filler. At the same time, the influence of the thermal conductivity of the material such as the construction of the thermal conductive path and the preparation process should also be considered.
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