18-inch Wafers

The introduction of 18-inch wafers has slowed down, mainly due to the need for large-scale investment in the initial stage. Due to changes in wafer size, related equipment must be changed. Not only new factories need to be built, but equipment also needs to be replaced. Said the burden is not small. Once the plan fails, it may lead to a greater impact, causing various equipment manufacturers to step on the brakes frequently.

At present, most of the semiconductor industry is turning to the use of existing equipment to develop and evolve in the direction of miniaturized and advanced manufacturing processes. The hope that used to be fading is now more and more elusive. At present, the 450mm wafer is not only not getting closer to us, but it is even more blurred.

Given the current economic and technological conditions, the move to 450mm wafers is likely to continue to be delayed. An executive from a semiconductor manufacturer said that the semiconductor industry will never slow down the speed of upgrading the node process, because it is widely believed that the benefits obtained from the reduction of the node process are more than those obtained from the use of larger wafers. The cost benefit is more important.

But things always have to develop. Now that the advanced process reaches 3nm or even 2nm, Moore’s Law is gradually stalling. I wonder if the industry will refocus its attention on 450mm wafers.

The ultrasonic coating system can use advanced layering technology to precisely control the flow rate, coating speed and deposition amount. Low-speed spray forming defines an atomizing spray as a precise, controllable pattern, avoiding excessive spraying when producing very thin and uniform layers. It turns out that direct spraying using ultrasonic technology is a reliable and effective way to deposit photoresist on 3D microstructures, thereby reducing equipment failures caused by excessive metal exposure to etchant.

Ultrasonic spray systems have proven to be suitable for a variety of applications that require uniform, repeatable photoresist or polyimide film coatings. Cheersonic’s coating system can control thicknesses from sub-micron to more than 100 microns, and can coat any shape or size. It is a feasible alternative to other coating technologies such as spin coating and traditional spray coating.

Cheersonic’s non-blocking ultrasonic coating technology is known for its ultra-thin micron-layer coatings of functional and protective materials. The ultrasonic vibration of the nozzle effectively dispersed the particles in the suspension and produced a very uniform particle dispersion in the film layer, while the conductive particles did not settle out of the suspension.