Megasonic Cleaning for Semiconductors

Megasonic Cleaning for Semiconductors – Megasonic Cleaning – Cheersonic

Spray megasonic cleaning is an efficient cleaning method that can remove nanoparticle contaminants on the wafer surface.

Megasonic cleaning uses megahertz-level ultrasonic energy to drive the removal of sub-micron particles and chemical reactions on the surface of substrates. Compared with the low-frequency ultrasonic cavitation effect, the megasonic cavitation effect can remove smaller particles and significantly reduce damage to the substrate. In the process of spray-type megasonic cleaning, the cleaning liquid forms a mist through the nozzle, and the megasonic waves act on the surface of the object to be cleaned through the cleaning liquid, achieving efficient and non-damaging cleaning.

It can not only complete large-area cleaning tasks in a short time, but also reduce damage to the objects being cleaned while ensuring the cleaning effect. It generates high-frequency vibration through a high-frequency oscillation circuit, converts this vibration into ultrasonic waves, and generates micro-jet and shock waves in the cleaning fluid to impact and vibrate the items to be cleaned, thereby removing dirt, grease, etc. attached to the surface of the items. Clean away impurities etc. In addition, the scope of application of spray megasonic cleaning is also very wide. It can be applied to the cleaning of various surface objects such as wafers, chips, and metals.

The emergence of spray megasonic cleaning technology has achieved efficient and non-damaging cleaning. If you also want to experience this new cleaning method, come and try it!

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