Ultrasonic Spray Technology Coats Polyimide on Wafer Chuck

Ultrasonic spraying technology coats polyimide on the wafer chuck. What is this process?

Ultrasonic spraying technology uses ultrasonic atomization technology to disperse liquid into tiny particles, forming particles ranging from a few microns to 100 microns in size. It is widely used in the field of spraying. The electronic semiconductor field is one of the typical applications of ultrasonic spraying. Polyimide coating is applied to wafer chucks to improve production efficiency.

The wafer chuck is used to support and fix the wafer so that semiconductor devices can be manufactured on the wafer. As a high-performance engineering plastic, polyimide has excellent high temperature resistance, corrosion resistance, fatigue resistance and other properties, and is widely used in the semiconductor industry. To improve the performance and reliability of semiconductor devices, polyimide coatings are required on wafer chucks. Ultrasonic spray technology is an effective coating method. This technology has the advantages of controllable droplet size, adjustable liquid flow rate, and variable spray pattern, and can adapt to various types of coating needs.

The application of ultrasonic spray technology not only injects new impetus into the development of the semiconductor industry, but also allows us to see the infinite possibilities of technology changing the future.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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