Pairuilin Coating Equipment

With the rapid popularization of 5G, Internet of Things (IoT), artificial intelligence (AI), and autonomous driving technologies, the complexity and precision of microelectronic devices continue to increase. From smartphones to smart cars, from wearable devices to industrial sensors, internal chips (ICs), microelectromechanical systems (MEMS) sensors, and printed circuit boards (PCBs) are facing multi-dimensional and rigorous environmental tests:

  • Environmental erosion: The widespread presence of moisture (H ₂ O) is the main cause of circuit failure, which can easily lead to ion migration, chemical corrosion, and mold growth, directly affecting device lifespan.
  • Mechanical stress: The complex 3D packaging structure, delicate wire bonding, and fragile MEMS moving parts are extremely sensitive to impact, vibration, and friction, and even slight external forces may cause damage.
  • Performance interference: High frequency and high-speed transmission signals require extremely high requirements for protective coatings, requiring excellent insulation and low dielectric loss to avoid affecting signal integrity.
  • Process bottleneck: In wafer level packaging (WLP) and chip level packaging (CSP), traditional liquid coatings cannot uniformly cover micrometer level gaps, and are prone to fatal defects such as bubbles, pinholes, and uneven thickness, which restrict yield improvement.

Pairuilin Coating Equipment | Semiconductor Conformal Coating

These challenges urgently require a revolutionary protective solution.

Core application scenarios of ultrasonic coating machine for coating Pirolin coating
Relying on the technological advantages of ultrasonic coating machines, the application of Pairuilin coating in multiple high-precision and cutting-edge fields is more adaptable, becoming an irreplaceable protective process:

01 Chip level and wafer level protection

  • Bare chip protection: After die attach and wire bonding, the Perelin coating is applied by an ultrasonic coating machine, which can replace heavy packaging to achieve ultra-thin packaging (UTCSP), effectively protecting aluminum/gold wires from corrosion and mechanical damage, and significantly improving device reliability.
  • Wafer level packaging (WLP): When used as a permanent passivation layer, applying ultrasonic coating machine to Perrin before wafer cutting can provide final surface protection and insulation, improving production yield; As a temporary protective layer, it can protect circuits during wafer cutting, grinding, and transportation, and can be subsequently removed without residue through pyrolysis or plasma technology.

02 “Exclusive Protection Solution” for MEMS Devices
The movable structure of MEMS devices requires extremely high protection requirements, and the Pareto coating applied by ultrasonic coating machines is the preferred solution:

  • Environmental protection: Coating gyroscopes, accelerometers, microphones, pressure sensors, and other devices with Parylene coating can achieve comprehensive protection against moisture, dust, and corrosion, ensuring their long-term stable operation.
  • Structural functional materials: Based on the stress free properties of Perrin, they can be accurately coated by ultrasonic coating machines and used as lubrication and anti adhesion layers for MEMS active structures (such as micro gears and micro mirrors), and even as sacrificial layer materials to release microstructures.

03 Advanced Packaging and Integration Field

  • Three dimensional integration (3D IC) and through silicon via (TSV): The Pairlin coating coated by an ultrasonic coating machine can serve as an interlayer dielectric layer (ILD), providing reliable insulation and protection for chip stack structures and meeting high-density integration requirements.
  • Dielectric material for redistribution layer (RDL): With good insulation, uniformity, and patterning properties (through photolithography and etching), the ultrasonic coating machine coated Perrine can be applied to advanced packaging such as Fan Out to improve packaging performance.

04 High frequency/radio frequency (RF) devices and optoelectronics

  • High frequency/microwave circuits: Applying Parylene coating in GaAs amplifiers, filters, antennas and other devices, its high insulation and low dielectric loss have minimal impact on signal integrity, ensuring stable high-frequency performance.
  • Optoelectronic devices: In OLED displays, the Perrine coated by ultrasonic coating machines can serve as a water oxygen barrier layer, effectively extending the lifespan of the display screen; In LED chips, it can protect the chip and light strip, improve weather resistance and reliability.

05 Emerging and Frontier Application Fields

  • Flexible Electronics: In the circuit protection of flexible substrates such as polyimide (PI) and PET, the Perilin coating coated by ultrasonic coating machine is flexible and bending resistant, making it an ideal protection choice for flexible displays and wearable devices.
  • Quantum dot and nanomaterial packaging: Precision coating with Perrin using an ultrasonic coating machine can protect environmentally sensitive quantum dots and nanomaterials, maintaining their stable performance.
  • Semiconductor cutting-edge manufacturing: Parylene N powder can be used to prepare graphene and applied in cutting-edge fields such as Schottky junction detectors, while ultrasonic coating machines can assist in precise coating on special structures.

The key to implementing the application of Pirolin coating on ultrasonic coating machine

Choosing an ultrasonic coating machine to apply Perrin coating as a protective solution is a systematic project, and successful application relies on three core elements:

01 Accurate selection of Parylene materials

Select the appropriate type of Perrine based on the specific application scenario:

  • Parylene C: The most widely used, with excellent moisture resistance and cost-effectiveness, suitable for most electronic protection scenarios.
  • Parylene N: With higher purity and superior dielectric properties, it is suitable for the protection needs of high-frequency signal devices.
  • Parylene D: higher chlorine content, better thermal stability (can withstand 125 ° C in the short term), better UV resistance than C-type, suitable for high-temperature electronic components and aerospace fields.
  • Parylene F (AF4): It has the best high-temperature resistance performance (short-term resistance to 450 ℃) and is suitable for device protection in high-temperature environments.
  • Parylene HT (SF): It combines high temperature resistance and high UV stability, suitable for the demanding requirements of aerospace and optoelectronics fields.

UAM1000 ECONOMICAL ULTRASONIC COATING EQUIPMENT

02 Professional Process Technology Support

Pre treatment (cleaning, plasma activation), parameter control of ultrasonic coating machine (temperature, pressure, ultrasonic frequency), monitoring of deposition process, post-treatment (mask removal, performance testing), each link is crucial and directly affects the yield and reliability of the final product. It is necessary to optimize the process plan through a professional technical team.

03 High performance ultrasonic coating machine equipment

A high-performance ultrasonic coating machine is the core foundation for stable production. It needs to have a precise temperature control system, efficient vacuum control module, automated operation function, and excellent film thickness uniformity. At the same time, it is integrated with an ultrasonic auxiliary module to optimize the distribution of Pareto monomers during the deposition process, further improving the uniformity and adhesion of the film layer, and adapting to the coating requirements of precision microelectronic devices.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

If you have any technical questions, customization demands, or procurement inquiries about ultrasonic atomization nozzles, feel free to contact our professional sales and technical team for detailed parameters, customized solutions, and industry application support.
Email: market2@cheersonic.com