Photoresist Coating

Cheersonic’s ultrasonic coating technology is used in applications that require material consumption, uniformity, repeatability and control. Our ultrasound technology is well known in the semiconductor industry and is used for precision photoresist coatings. Cheersonic’s UAM4000L photoresist coater is the ideal equipment to provide uniform photoresist coverage for deep hole topography such as MEMs and other challenging applications with insufficient spin coating. By forming very small, controllable droplets, this unique technology can uniformly cover the photoresist with deep hole topography (such as MEM) and other challenging applications where spin coating is insufficient. Other applications include polyimide, flux distribution for flip chip applications, and thin film solar/display applications, such as TCO layers, nano suspensions (CNT, graphene, nanowires, etc.), OPV polymers, AR and CIGS active layers . For more information, please visit https://cheersonic-liquid.com/.