Ultrasonic Photoresist Coating Machine for AMB Ceramic

AMB ceramic substrate copper plate photoresist exposure and development ultrasonic photoresist coating machine

In the field of power semiconductor packaging, AMB (Active Metal Brazing) ceramic substrates have become the core carrier of high-end power modules due to their high thermal conductivity and excellent insulation properties. The copper plate photoresist exposure and development process directly determines the accuracy of circuit graphics and substrate reliability. Ultrasonic coating machines and photoresist coating machines, as key equipment, undertake the core responsibility of precise photoresist coating and are important supports for ensuring process stability.

The ultrasonic coating machine relies on the atomization principle of high-frequency ultrasonic vibration to adapt to the photoresist coating requirements of AMB ceramic substrate copper plates, solving many pain points of traditional coating processes. Its core is to atomize photoresist into uniformly sized micrometer sized droplets through ultrasonic oscillators, and gently deposit them on the surface of copper plates under low-pressure airflow guidance, achieving non-contact coating and avoiding mechanical damage to the copper plate surface. Compared to traditional spin coating processes, the material utilization rate of ultrasonic coating machines has been increased to over 90%, significantly reducing the waste of high cost photoresist. At the same time, the coating thickness can be accurately controlled, and flexible adjustment can be achieved within the range of 10nm to 100 μ m. The uniformity error is controlled within ± 2%, effectively avoiding defects such as edge accumulation and pinholes, and adapting to the preparation needs of precision circuits on AMB substrates. In addition, its low-speed and gentle spraying characteristics can adapt to the microstructure of copper plate surfaces, improve step coverage, and lay the foundation for the integrity of subsequent exposure and development patterns.

The photoresist coating machine is a specialized equipment for AMB copper plate photoresist exposure and development process, focusing on the special adaptability and process stability of photoresist coating. Based on the material characteristics of AMB ceramic substrate copper plate, this equipment is compatible with precision coating of liquid photoresist. By optimizing the supply system and coating parameters, uniform spreading of photoresist can be achieved. The device supports multiple modes such as spin coating and slit coating. Among them, slit coating is suitable for large-scale production, and the film thickness uniformity can reach within ± 0.5%, which can meet the substrate circuit requirements derived from advanced processes of 7nm and below; The spin coating mode is suitable for small-scale research and development, balancing cost and basic accuracy. After coating, it can be linked with a pre drying module to remove excess solvents in the photoresist, form a stable film, avoid pattern distortion during subsequent exposure, and improve the adhesion between the photoresist and the copper plate, reducing the problem of pattern collapse during the development process.

Two devices work together in the AMB copper plate photoresist exposure and development process to form a complete pre coating system. At the beginning of the process, the ultrasonic coating machine completes the initial precise deposition of photoresist, relying on its excellent microstructure adaptability to ensure that the copper plate surface and high aspect ratio grooves can be covered with a uniform adhesive layer; Subsequently, the photoresist coating machine performs secondary precision coating, calibrates film thickness deviation, optimizes film surface flatness, and adapts to circuit pattern requirements of different accuracies. After coating is completed, the substrate enters the exposure stage, where ultraviolet light passes through the mask plate to irradiate the photoresist, triggering a reaction. The unreacted photoresist is then developed to remove it, ultimately forming the predetermined copper plate circuit pattern. The coating accuracy of the two coating devices directly determines the accuracy of pattern transfer, affecting the conductivity and heat dissipation efficiency of the substrate.

Currently, with the upgrading of power semiconductors towards high density and miniaturization, the circuit accuracy requirements of AMB ceramic substrates continue to increase, promoting the intelligent and high-precision upgrading of ultrasonic coating machines and photoresist coating machines. Both devices are gradually introducing intelligent control systems to achieve real-time monitoring and adaptive adjustment of coating parameters, reducing the impact of environmental temperature and humidity on coating effectiveness. Against the backdrop of accelerated domestic substitution, coating equipment adapted to AMB technology is breaking through core technology bottlenecks, optimizing the performance of precision components, meeting the production needs of high-end substrates while reducing production costs, and providing equipment support for the high-quality development of the power semiconductor industry.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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