Spraying 2UM Photoresist

Ultrasonic glue sprayer: Precisely spraying 2UM photoresist, reshaping precision manufacturing to a new level

In precision manufacturing fields such as semiconductor chip manufacturing and micro-electromechanical systems (MEMS), the spraying accuracy of photoresist is a key factor in determining product performance and yield. For photoresist coating requirements of only 2UM thickness, traditional glue spraying methods are difficult to meet its stringent standards, and ultrasonic glue sprayers, with innovative technology, have brought revolutionary breakthroughs to photoresist spraying and become an important boost to the high-quality development of the industry.

Traditional photoresist spraying equipment, such as brush coating and ordinary spraying, faces many difficulties when dealing with 2UM thick photoresist. The brush coating method is inefficient and it is difficult to accurately control the coating thickness. It is very easy to have problems such as uneven thickness and flow marks, and it is impossible to achieve micron-level precise spraying; ordinary spraying is due to the different sizes and uneven distribution of atomized particles, resulting in uneven deposition of photoresist on the substrate surface. The coating thickness difference between the edge and the center area is obvious, which seriously affects the transfer accuracy of subsequent photolithography patterns and causes a decrease in product yield.

The ultrasonic glue sprayer uses the cavitation effect of high-frequency ultrasound to atomize the photoresist into uniform, fine nano-scale particles. Unlike traditional processes, the tiny particles generated by ultrasound can be evenly and stably deposited on the substrate surface under the guidance of precisely controlled airflow, achieving precise spraying of 2UM thick photoresist coating. Through precise parameter control, the equipment can strictly control the coating thickness error within ±0.1UM, and can obtain consistent and high-quality photoresist coatings for both large-area flat substrates and special-shaped substrates with complex microstructures.

In actual application scenarios, the advantages of ultrasonic glue sprayers have been fully verified. In the manufacturing process of advanced semiconductor chips, the use of this equipment to spray 2UM thick photoresist can accurately construct fine circuit patterns, improve the accuracy of the critical dimension (CD) of the chip by 35%, effectively reduce circuit defects caused by uneven photoresist coating, and increase product yield to more than 92%. In the production of MEMS sensors, for substrates with complex three-dimensional structures, the non-contact spraying characteristics of the ultrasonic glue sprayer avoid physical damage to the microstructure of the substrate, while ensuring that the 2UM thick photoresist evenly covers every detail, ensuring the sensitivity and stability of the sensor.

In addition, the ultrasonic glue sprayer is also highly flexible and adaptable. According to different photoresist characteristics, substrate materials and production requirements, the ultrasonic frequency, glue spraying flow, nozzle movement speed and other parameters can be freely adjusted. Its efficient spraying efficiency is nearly 3 times higher than that of traditional processes, greatly shortening the production cycle. CHEERSONIC continues to upgrade the technology of ultrasonic glue sprayers and optimize the intelligence of the equipment. The intelligent monitoring system can monitor various parameters in the spraying process in real time and automatically adjust to ensure that each 2UM thick photoresist spraying operation can be completed stably and efficiently.

As the precision manufacturing industry develops towards higher precision and higher performance, the requirements for photoresist spraying processes are becoming more stringent. With its outstanding performance in 2UM thick photoresist spraying, ultrasonic glue spraying machine will surely become the mainstream choice in the industry and continue to provide solid support for technological innovation and industrial upgrading in the fields of semiconductors, MEMS and so on.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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