Photoresist Coating for Wafers

Photoresist Coating for Wafers – Cheersonic Spray Coater

In the realm of microelectromechanical systems (MEMS) and semiconductor manufacturing, the Ultrasonic Spray Of Photoresist For MEMS Wafers And Other Substrates With Varying Topographies has emerged as a game-changer. Ultrasonic spray technology offers a streamlined, cost-effective, and highly reproducible solution for applying photoresist coatings during photolithography wafer processing.

When dealing with MEMS wafers and substrates possessing complex and diverse topographies, traditional coating methods often struggle to achieve uniform coverage. However, the ultrasonic spray process shines in this regard. It enables direct spray coating, which has been rigorously tested and verified as a dependable and efficient means of depositing photoresist onto 3D microstructures. By precisely controlling the spray parameters, such as droplet size and velocity, it ensures an even distribution of the photoresist layer. This, in turn, significantly curtails the risk of device failure that can occur when the metal is overexposed to etchant. As a result, it not only boosts the yield of high-quality devices but also accelerates the overall manufacturing process, making it an indispensable technique in modern microfabrication.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

Chinese Website: Cheersonic Provides Professional Coating Solutions